MTS Hardware Development Engineer

At AMD, we believe technology can change lives for the better. It can heal us, entertain us, and make us more connected, productive, and understanding of the world around us. We’re looking for talent who want to leave the planet better than they found it—people who don’t shy away from humanity’s challenges but are determined to help solve them. AMD powers the next generation of supercomputing, high-performance computing, cloud, and AI. Every role at AMD contributes to technology that moves the world forward.

Responsibilities

• Support engineering team by loading, testing, and validating thermal solutions for rack mount servers.
• Recommend design changes and optimize configurations.
• Use simulation early in the design process to prevent failure modes in products and assist in problem resolution.
• Troubleshoot thermal and airflow issues in new and existing product lines.
• Work with the engineering team to optimize thermal performance of servers using empirical data and bench test methods.
• Optimize airflow speed, volume, and flow paths to meet customer and component requirements.
• Support custom engineering projects requiring hands-on ability to interconnect complex server systems.
• Use analytical tools to determine root cause and design changes required to remedy premature failures.
• Produce thermal reports from experimental data and test/modeling benchmarks.
• Create manufacturing-feasible new product concepts by applying engineering principles and analytical techniques.
• Develop CFD and thermal simulation methods and integrate them into existing/emerging engineering development processes.
• Utilize knowledge of mechanics, heat transfer, and computational fluid dynamics, as well as design techniques, tools, and principles.
• Apply knowledge of engineering principles, best practices, and technologies to the design, development, and testing of proprietary products.

Multiple openings available.

Requirements

• Master’s degree or foreign equivalent in Mechanical Engineering, Computer Engineering, or related field.
• Three (3) years of experience in the job offered or a closely related engineering role.

Alternatively, employer will accept a Bachelor’s degree or foreign equivalent in Mechanical Engineering, Computer Engineering, or related field and five (5) years of progressive post-baccalaureate experience in the job offered or a closely related engineering role.

Skills

The following skills are required (three (3) years of experience in each):

• Complete thermal design and validation cycle of HPC, AI, and storage servers.
• Conducting system-level thermal simulations to evaluate chassis airflow distribution, identify thermal bottlenecks, and optimize component thermal performance.
• Defining and executing thermal test plans.
• Designing and developing custom heat sinks and cold plates.
• Selecting thermal interface materials (TIMs) to meet cooling demands of high-power CPUs and GPUs.
• Validation of heat sink and fan designs.

Benefits

AMD offers a comprehensive benefits package. Details are available on the AMD careers site.