Module Development Engineering Manager

About the Role

Join Intel's Module Development Engineering team as a manager, where you will lead a group of talented engineers in crafting innovative solutions for next-generation technology development in wafer processing, assembly/test, and module repair factories. As a key driver of Intel's technological advancement, you will play a pivotal role in ensuring the successful development, transfer, and implementation of cutting-edge technologies that enable Intel's leadership in power performance, structural efficiency, and cost optimization. This role offers an opportunity to make a significant impact on Intel's global manufacturing capabilities and future technological roadmap.

Responsibilities

• Lead a team of module development engineers to develop, implement, and transfer advanced technology solutions.
• Define and oversee technology roadmaps for the module, ensuring alignment with Intel's strategic goals.
• Manage resources, set priorities, and foster collaboration across teams to meet project schedules and maximize operational outcomes.
• Partner with integration, device, and yield engineering teams to develop robust process solutions that deliver power performance and area leadership.
• Build and maintain partnerships with supplier executive management to nurture unique industry ideas and research innovations.
• Coach and mentor engineering teams in pathfinding and technology road mapping for advanced technology development.
• Develop long-term strategies for module engineering capabilities to support emerging technological requirements.
• Ensure accountability and drive team results by setting clear goals, performance benchmarks, and maintaining alignment with Intel's values.
• Promote an inclusive and productive work environment while inspiring individuals and developing their professional capabilities.

Requirements

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

• Bachelor’s degree in engineering, Materials Science, Physics, or related fields with 6+ years of experience.
• Master’s degree in engineering, Materials Science, Physics, or related fields with 4+ years of experience.
• PhD in Optics, Physics, Engineering, Materials Science, or related fields with 2+ years of experience.
• Demonstrated expertise in optical characterization, scripting, statistics, data analytics, and problem solving.
• Leadership experience in managing engineering teams and driving results in complex environments.

Preferred Qualifications

• Experience in Metrology and defect inspections equipment, semiconductor fabrication, packaging technologies, or advanced module engineering.
• Strong technical understanding and ability to distill conflicting data inputs into actionable solutions.
• Familiarity with wafer equipment, processes, or singulation techniques.
• Experience as a technical leadership role or metrology tool ownership.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Pay

Annual Salary Range for jobs which could be performed in the US: $133,800.00 - 219,550.00 USD. The range displayed reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Schedule

This role will require an on-site presence (Shift 1 in the United States of America). Primary location: US, Oregon, Hillsboro.