Mechanical Design Engineer

Responsibilities

• Create CAD models of package stack-up and associated components.
• Perform mechanical design analysis to identify and implement solutions that improve package mechanical integrity.
• Execute tolerance stack-up analyses and create GD&T drawings for advanced packages — including optically aligned assemblies where micron-level precision defines product performance.
• Apply manufacturing expertise to influence design choices, perform FMEAs, and evaluate the cost implications of process and design decisions.
• Collaborate with package and systems teams to ensure packaging solutions comply with system boundary conditions.

Requirements

• BS or MS in Mechanical Engineering or a related field.
• Minimum of 3 years of mechanical design experience in semiconductor packaging, optoelectronics, or photonics modules.
• Proficiency in CAD tools such as Solidworks or Creo, with a focus on mechanical design best practices.
• Expertise in Geometric Dimensioning and Tolerancing (GD&T) and tolerance stack-up analysis.
• Manage prototype builds with external vendors, validating the designs, and ensuring the scalability to high volume manufacturability.
• Working knowledge of semiconductor packaging technologies, including the mechanical and thermal trade-offs of 3D, 2.5D, and FCBGA architectures.

Preferred Qualifications

• Knowledge of ASME Y14.5 standards.
• Ability to drive results independently and with minimal supervision.
• Working knowledge of FEA tools (ANSYS, Abaqus, or similar) for structural and thermal analysis.
• Fiber array unit (FAU) attach, optical connector, or photonic alignment experience.
• Experience with liquid cooling or advanced thermal architectures for AI/HPC systems.
• Exposure to high-volume manufacturing and OSAT engagement in Asia.
• Strong cross-functional communication skills and a bias toward fast, data-driven iteration.