Marketing Programs Manager - 3D IC Design & Advanced Packaging Solutions - Siemens EDA

Key Responsibilities

• Strategic Planning & Leadership for 3D IC/Advanced Packaging
  • Architect comprehensive, data-driven marketing strategies tailored to Siemens EDA's 3D IC design, multi-die integration, and advanced packaging solutions.
  • Align with growth initiatives and market positioning.
  • Identify emerging platforms, industry trends (e.g., chiplets, wafer-on-wafer, hybrid bonding), and innovative approaches to maximize Siemens EDA's market visibility and competitive differentiation.
  • Articulate the value proposition of Siemens EDA's solutions for addressing critical 3D IC challenges such as thermal management, power delivery, signal integrity, co-design, and verification.
• Campaign Management & Execution
  • Orchestrate integrated, multi-channel marketing campaigns that deliver measurable business outcomes for our 3D IC and advanced packaging offerings.
  • Ensure consistent brand messaging and visual identity across all marketing assets and touchpoints, highlighting Siemens EDA's expertise in heterogeneous integration.
  • Direct external agencies and vendors to deliver high-quality, on-brand campaign elements, potentially including technical white papers, application notes, and webinars focused on 3D IC methodologies.
• Cross-functional Collaboration
  • Partner closely with product management, R&D, sales, and executive leadership to align marketing initiatives with business objectives for our 3D IC and advanced packaging portfolio.
  • Build strong stakeholder relationships across the organization to drive marketing integration and effectiveness, particularly with teams focused on physical verification, design for test (DFT), and system-level analysis for 3D ICs.
• Performance Measurement & Optimization
  • Establish key performance indicators (KPIs) to measure campaign effectiveness and return on investment for 3D IC-focused marketing initiatives.
  • Refine marketing approaches based on performance data and market feedback, adapting to the rapid evolution of 3D IC and advanced packaging technologies.
  • Monitor competitor activities and market trends in the 3D IC and advanced packaging space to inform strategic marketing decisions.

Required Qualifications

• Bachelor’s degree in Marketing, Business Administration, Electrical Engineering, Computer Engineering, or a related technical field.
• Deep understanding and passion for 3D IC design, heterogeneous integration, advanced packaging technologies (e.g., 2.5D, chiplets, fan-out), and the associated EDA challenges (e.g., thermal, power, reliability, co-design).
• Outstanding communication and presentation skills with the ability to influence at all organizational levels, including technical experts and executive leadership.
• Strong analytical skills with experience in marketing metrics analysis and performance optimization.