Lead / Principal IC Packaging Design Engineer

Role Overview

We are seeking a Lead IC Packaging Design Engineer with extensive experience in advanced semiconductor package development. This role will lead package implementation, guide complex substrate designs, collaborate with architecture, SI/PI, manufacturing, and reliability teams, and drive high-quality package solutions from concept through production.

Key Responsibilities

• Lead advanced semiconductor package design projects.
• Drive complete package implementation using Siemens Xpedition or Cadence APD.
• Define substrate architecture and layout strategy.
• Lead SI/PI-aware package implementation.
• Ensure package manufacturability, yield, and reliability.
• Review package floorplans and routing methodologies.
• Drive design rule compliance across projects.
• Collaborate with architecture, manufacturing, and reliability teams.
• Resolve complex package design challenges.
• Mentor package design engineers.
• Support customer reviews and technical discussions.
• Contribute to package design process improvements and best practices.

Required Qualifications

• Bachelor's or Master's degree in Electrical/Electronics Engineering.
• 10+ years of IC Packaging Design experience.
• Proven experience leading advanced package design programs.
• Strong knowledge of package architecture, substrate design, and package implementation.

Technical Skills

• Package Design Platforms: Siemens Xpedition (Mentor Graphics XPD), Cadence APD, Cadence Allegro, Cadence SiP.
• Advanced Semiconductor Packaging.
• Package Architecture.
• High-Density Substrate Design.
• Advanced Package Layout.
• Flip Chip.
• Multi-Chip Package Design.
• SiP Package Design.
• Design Engineering.
• Physical Package Design.
• SI/PI Optimization.
• Reliability Engineering.
• Yield Improvement.
• Design Rule Compliance.
• Design for Manufacturability (DFM).

Leadership

• Technical Leadership.
• Design Reviews.
• Engineering Mentorship.
• Cross-functional Collaboration.