Intern - Memory Design Engineer, HBM

About the role

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that power Artificial Intelligence (AI), high-performance computing, graphics, and data center applications. Our team collaborates across Design, Verification, Physical Design, Product Engineering, and CAD organizations to deliver next-generation memory technologies. As an HBM Design Engineer Intern, you will work alongside experienced engineers on the design, development, and validation of advanced HBM products. This internship provides hands-on experience with semiconductor design methodologies, industry-standard EDA tools, and AI-assisted engineering workflows while contributing to real-world memory design projects in a collaborative global environment.

Responsibilities

• Assist with HBM memory and logic design activities, including RTL development, circuit implementation, simulation, verification, and functional analysis.
• Develop and use scripting, automation, and AI-assisted workflows to improve design productivity, debug efficiency, and design-flow quality.
• Perform timing, power, and functional analysis of HBM subsystems and support design reviews, technical investigations, and root-cause analysis using AI-enabled engineering techniques where appropriate.
• Collaborate with Design Verification, Physical Design, CAD, and Product Engineering teams to support project execution and product development.
• Document technical work, experimental results, build methodologies, and AI-assisted insights to support collaboration and ongoing improvement.

Requirements

• Currently pursuing a Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field.
• Completed coursework in Digital Logic Design, CMOS Circuits, Computer Architecture, VLSI Design, Semiconductor Devices, or equivalent subjects.
• Demonstrated understanding of combinational and sequential logic design concepts and familiarity with Verilog, SystemVerilog, or VHDL.
• Programming experience in Python, Perl, Tcl, C/C++, or similar languages.
• Strong analytical, debugging, problem-solving, communication, and teamwork skills.

Skills

• Knowledge of memory architectures such as DRAM, SRAM, DDR, LPDDR, or HBM.
• Experience with RTL design, simulation, synthesis, timing analysis, or verification methodologies through coursework, research, or internships.
• Familiarity with Linux/Unix environments, scripting, and semiconductor EDA tools such as VCS, Xcelium, Questa, PrimeTime, Innovus, or Virtuoso.
• Understanding of functional coverage, design verification concepts, and semiconductor development flows.
• Previous academic, research, or internship experience involving VLSI, ASIC, FPGA, memory design, or the application of Artificial Intelligence (AI) tools to enhance engineering productivity and analysis.

Benefits

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.