Senior Memory Design Engineer, HBM

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Responsibilities

• Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution.
• Utilize AI‑enabled tools to assist with schematic editing, data collection and layout floorplan.
• Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership.
• Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts.
• Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits.
• Prepare and maintain design documentation while contributing to best‑known practices and departmental training.
• Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality.
• Manage layout and develop resources, track project tasks, and serve as the point of contact for design, layout, verification, and test issues.
• Prepare project status reports and lead design reviews to communicate progress and technical decisions.

Qualifications

• Coursework in CMOS Circuit Design, VLSI, and Analog Circuit Design, with understanding of device reliability and circuit floor planning.
• Proficiency with Cadence Virtuoso, and experience simulating with FINESIM, HSPICE, and VERILOG.
• Strong analytical and problem‑solving skills with proven significant technical contributions and a record of innovation.
• Expertise in DRAM subsystem architecture, specification, operation, or design, including cross‑department technical leadership experience.
• Ability to proactively collaborate across multiple engineering organizations to optimize manufacturing quality, cost, reliability, and time‑to‑market.

Preferred Qualifications

• Self‑motivated with strong problem‑solving abilities and a drive to discover new solutions.
• Deep knowledge of industry‑specific technologies and competitive trends.
• Excellent communication and interpersonal skills for cross‑functional collaboration.
• BS or MS in Electrical Engineering or related field plus 3‑5 years of experience in DRAM design, product, or system.

Benefits

• Choice of medical, dental, and vision plans in all locations.
• Benefit programs that protect income if unable to work due to illness or injury.
• Paid family leave.
• Robust paid time‑off program and paid holidays.
• Additional details available in the Benefits Guide on micron.com/careers/benefits.