Jobs · Engineering · Arizona

Integration Director

Amkor Technology, Inc. · Greater Phoenix Area · 1 wk ago
HybridEngineeringFull-time

Position Summary

Amkor is currently seeking a Director, Chiplets and FCBGA for our Tempe, AZ office. The primary function of this position is program management for development of advanced chiplet-based IC Packages including HDFO (High Density Fan-out) and other advanced IC Package constructions for Computing, Networking and Mobile market spaces. This person will be the primary interface with Tier 1 customers and Amkor's leading edge R&D center in South Korea.

Essential Duties and Responsibilities

  • Drive and coordinate development activities with customers, in conjunction with Amkor's R&D development teams in Korea.
  • Lead Tier 1 customer interface meetings, discussions and follow-up actions during the project development phase.
  • Manage a cross-functional team with all Amkor resources as required to execute the project in a timely manner, including R&D, Design, Characterization and Simulation teams.
  • Manage customer product management through the development phase and into initial production ramp.

Required Qualifications

  • Bachelor's Degree in Engineering, with Mechanical Engineering or Materials Science preferred. A Master's degree is a plus.
  • 10+ years of experience in semiconductor package development is required, with direct experience in IC Packaging.
  • The qualified candidate understands the IC package design environment, and tradeoffs associated with package design during process development of FCBGA packages.
  • A working knowledge of mechanical stress/strain and IC package warpage is required.
  • Deep knowledge of IC packaging materials, failure modes and reliability qualification procedures is required.
  • Excellent written and verbal communication skills are needed.
  • This position requires 10-20% travel including domestic and international travel.

Preferred Qualifications

  • Expertise in high-density fan-out (HDFO) or bridge-like chiplet module constructions, constraints and tradeoffs.
  • Mechanical or Thermal simulation experience.
  • Familiarity with Design of Experiments and Statistical Process Control.

Location

Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.

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