Fab Process Engineer

Job Summary

The process engineer is a team member of the MEMS organization and is responsible for sustaining the existing generation of technology, leading and supporting the transition of products and manufacturing processes from prototype to full production, and for developing new processes in support of new product or technology development.

Responsibilities

• Uses Design of Experiment methodology to characterize process space and develop new production processes.
• Creates test plans to validate processes.
• Qualifies new production processes using organizational change management procedures, in partnership with engineering and operations stakeholders.
• Specifies new tooling and capital equipment purchases that are necessary for workcenter Assurance of Supply
• Led the workcenter and drives improvement in the following key areas: process sustaining, quality, equipment and capacity, and process development.
• Exercises technical judgement, creativity, and initiative with attention to detail consistently throughout work output.
• Collaborates and communicates with management, worldwide engineering partners, internal, and outsourced development partners regarding status, project progress, and issue resolution.
• Leads project team of other process engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for moderately-complex products.
• Solves difficult and complex problems with fresh perspective, demonstrating good judgment in selecting creative solutions and managing projects independently.
• Delivers professionally written reports, and supports realization of operational and strategic plans.
• Provides guidance and mentoring to less-experienced staff members to set an example of process design and development, innovation, and excellence.

Requirements

• Recommended Four-year or Graduate Degree in Chemical Engineering, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or other related discipline.
• Typically has 4-7 years of work experience, preferably in wafer or package fab process engineering, with experience in process development, stabilization, sustaining, and quality systems.
• Prior experience with Atomic Layer Deposition (ALD), Physical Vapor Deposition (PVD), and Plasma Enhanced Chemical Vapor Deposition (PECVD) strongly preferred.

Qualifications

• Knowledge & Skills:
  • Process development and characterization
  • Process qualification
  • Change management
  • Process and tooling
  • Equipment specification
  • Technical communication
  • Electrical Engineering
  • Mechanical Engineering
  • Materials Science
  • Physics
  • Wafer fab
  • Package fab
  • Plasma physics
  • Plasma processes
  • Atomic Layer Deposition (ALD)
  • Physical Vapor Deposition (PVD)
  • Plasma Enhanced Chemical Vapor Deposition (PECVD)

Pay

The pay range for this role is $93,400 to $143,800 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only).

Benefits

HP offers a comprehensive benefits package for this position, including:

• Health insurance
• Dental insurance
• Vision insurance
• Long term/short term disability insurance
• Employee assistance program
• Flexible spending account
• Life insurance
• Generous time off policies, including;
  • 4-12 weeks fully paid parental leave based on tenure
  • 11 paid holidays
  • Additional flexible paid vacation and sick leave (US benefits overview)