Engineering Laboratory Technician - II # 26-18326

About the role

The candidate will be responsible for conducting failure analysis to identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.

Responsibilities

• Conduct failure analysis on electrical & thermal mechanical packages
• Support root cause understanding of new package technologies

Requirements

• Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, and SEM/EDX on printed circuit board
• Knowledge of packaging material property and behavior is beneficial
• Good verbal and technical writing skills
• Work well with a team
• Deliver under pressure
• Well organized

Qualifications

• Minimum educational qualification is an AS degree in science or engineering
• 2-4 years’ experience in failure analysis, material analysis, process development or analytical tool development
• Must be able to stand and work for at least 6 hours

Skills

• Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, and SEM/EDX on printed circuit board
• Knowledge of packaging material property and behavior
• Good verbal and technical writing skills
• Teamwork skills
• Ability to deliver under pressure
• Organized

Benefits

N/A

Pay

N/A

Schedule

Standard Day Shift

About US Tech Solutions

US Tech Solutions is a global staff augmentation firm providing a wide range of talent on-demand and total workforce solutions. To know more about US Tech Solutions, please visit www.ustechsolutions.com. US Tech Solutions is an Equal Opportunity Employer.

AI Statement

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