Engineer II, Global Product Management

Key Responsibilities

• Serve as a system-level technical expert for advanced CMP platforms across development and customer environments
• Support new product introductions (NPI), including first builds, qualification, and First-In-Fab deployments
• Lead advanced troubleshooting and root cause analysis for complex tool and process issues beyond first-line support
• Drive continuous improvement by feeding field learnings back into engineering, influencing design and process changes
• Partner cross-functionally with R&D, manufacturing, supply chain, and field service teams to ensure seamless product performance
• Support customers globally, including escalation management and direct engagement during critical issues
• Develop strategies to improve tool uptime, reliability, and total cost of ownership (TCO)
• Contribute to development of procedures, documentation, and training materials for field teams

Qualifications

• 8+ years of semiconductor equipment experience (or equivalent hands-on experience)
• Strong troubleshooting and problem-solving skills at system level
• Experience working with cross-functional teams and customer-facing environments
• Software Knowledge: Ability to travel internationally as required
• Familiarity with CMP, polishing, or similar wafer processing equipment
• Experience with NPI, tool install, and qualification processes
• Experience using data/analytics tools (Excel, JMP, Python, etc.) for performance analysis
• Knowledge of semiconductor manufacturing processes and fab operations
• Prior experience supporting global customers or high-volume manufacturing