Electroplating Engineer
EnaChip · Philadelphia, PA · 4 days ago
On-siteEngineering$90k–$115k/yrFull-time
Key Responsibilities
- Develop and optimize electroplating processes for magnetic alloy deposition
- Characterize processes, improve yield, and integrate electroplating with semiconductor fabrication flows
- Scale electroplating processes from R&D to wafer- and panel-level production
- Collaborate with materials and design teams to tune conductor and magnetic layer properties
Qualifications
- Bachelor's degree in Materials Science, Chemical Engineering, Electrical Engineering, or related field
- 3-5 years of experience with electroplating/electrochemical deposition in a semiconductor or advanced manufacturing environment
- Experience with multiple power supply types, bath metrology/monitoring equipment, SPC/DOE and related software (JMP), and thin-film characterization
- Knowledge of plating bath chemistry, current density optimization, and thin-film characterization
- A strong process-ownership mindset — you define it, you build it, you scale it
Nice to Have
- Experience in a startup or early-stage hardware environment
Pay
Base salary range: $90,000–$115,000, commensurate with experience and qualifications
Schedule
Work onsite in Philadelphia