DIRECTOR, CHIPLETS/FCBGA INTEGRATION

About the Role

Amkor is seeking a Director of Chiplets and FCBGA to lead program management for the development of advanced chiplet-based IC packages, including HDFO (High Density Fan-out) and other advanced constructions for Computing, Networking, and Mobile markets. This role serves as the primary interface with Tier 1 customers and Amkor’s R&D center in South Korea.

Responsibilities

• Drive and coordinate development activities with customers in collaboration with Amkor’s R&D teams in Korea.
• Lead Tier 1 customer interface meetings, discussions, and follow-up actions during the project development phase.
• Manage a cross-functional team, including R&D, Design, Characterization, and Simulation teams, to execute projects in a timely manner.
• Oversee customer product management through the development phase and into initial production ramp.

Requirements

• Bachelor’s Degree in Engineering (Mechanical Engineering or Materials Science preferred). A Master’s degree is a plus.
• 10+ years of experience in semiconductor package development, with direct experience in IC packaging.
• Understanding of IC package design tradeoffs during process development of FCBGA packages.
• Working knowledge of mechanical stress/strain, IC package warpage, and IC packaging materials.
• Deep knowledge of failure modes and reliability qualification procedures.
• Excellent written and verbal communication skills.
• 10-20% travel required, including domestic and international.

Preferred Qualifications

• Expertise in high-density fan-out (HDFO) or bridge-like chiplet module constructions, constraints, and tradeoffs.
• Mechanical or thermal simulation experience.
• Familiarity with Design of Experiments and Statistical Process Control.

Schedule

This position has a hybrid schedule. Candidates must reside near the Tempe, AZ office or be willing to relocate.