Design Department Manager

Responsibilities

• Team Leadership:

Lead a large, multidisciplinary team of engineers and design professionals working on the largest and most advanced semiconductor facilities in the United States.

• Project Coordination:

Orchestrate complex design and construction projects, ensuring seamless integration between design and construction teams across functional areas, including Mechanical, Electrical, Process, Structural, and Water systems.

• Design & Permitting:

Manage and oversee design activities from the baseline basis-of-design through the permitting process with local Authorities Having Jurisdiction (AHJs).

• Construction Management:

Lead coordination efforts with TSMC’s Construction team to address construction and pre-construction issues and drive commissioning activities for all systems.

• Ecosystem Development:

Help develop TSMC’s ecosystem of construction partners, EORs, AORs, vendors, suppliers, and design partners, ensuring alignment with project objectives and timelines.

• Critical Path Troubleshooting:

Identify and resolve critical path bottlenecks, driving issues to completion and ensuring project milestones are met.

• Cost Management:

Work through project costs and lead value engineering efforts whenever necessary to optimize project budgets and timelines.

• Safety & Quality:

Plan and execute TSMC’s safety and quality programs in collaboration with construction partners to ensure compliance with industry standards and best practices.

• Equipment Procurement:

Drive long lead equipment requirements and awards in coordination with procurement teams.

Qualifications/Requirements

• Education:

Bachelor’s degree in Engineering (Mechanical, Chemical, Electrical).

• Technical Skills:
• 10+ years proven expertise in managing complex engineering projects.
• Proficient in MS Office Suite and AutoCAD.
• Experience interfacing between Construction & Design teams.
• Familiarity with local AHJs and code reviewers.
• Interpersonal Skills:
• Strong communication skills.
• Computer proficiency.
• Effective presentation skills.
• Active listening abilities.
• Demonstrated teamwork and leadership skills.

Benefits

• Comprehensive and competitive benefits program including medical, dental, and vision plans.
• Income-protection programs to financially assist during injuries or illnesses.
• A 401(k)-retirement savings plan to secure financial future.
• Competitive paid time-off programs and paid holidays.

Physical Requirements

• Ability to travel as required.
• Ability to work in construction environments, requiring walking, standing, and occasional lifting.

Work Location

5088 W. Innovation Circle, Phoenix, AZ 85083

About the Role

TSMC Arizona’s first fab will operate its leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future.