Business Development Manager- Emerging Growth Marketing

Key Responsibilities

• Identify and develop new business opportunities for SiC in advanced packaging applications — including backside cooling layers, passive interposers, and active interposers — across a range of high-growth markets such as AI accelerators and HPC, co-packaged optics and optical I/O, quantum computing systems, and AR/VR platforms.
• Build executive-level relationships with leading AI chip designers (e.g., hyperscalers, GPU/ASIC OEMs), foundries (e.g., TSMC), OSATs, EDA players, photonics/CPO and optical-module suppliers, quantum hardware developers, and AR/VR OEMs and silicon teams to secure design-ins, joint development programs, and long-term supply agreements.
• Drive co-development programs and PDK-led engagements that embed SiC into customer packaging design flows across AI, HPC, co-packaged optics, quantum, and AR/VR use cases, converting material expertise into durable ecosystem lock-in.
• Lead strategic contracts, licensing, and partnership negotiations — balancing revenue growth, risk mitigation, and long-term scalability in nascent but fast-growing markets.
• Work closely with materials, technology development, and applications engineering teams to align growth initiatives with SiC process capabilities and packaging integration requirements across data center, photonics, quantum, and immersive-device form factors.
• Monitor competitor activities, foundry roadmaps, AI hardware trends, to shape business development strategy and positioning for SiC.

Qualifications

• Bachelor's degree in Electrical Engineering, Materials Science, or related technical field.
• 10+ years of experience in business development, strategic partnerships, or sales within advanced semiconductor packaging, materials, or the semiconductor supply chain.
• Strong understanding of advanced packaging architectures (2.5D/3D, CoWoS, EMIB, Foveros, chiplet integration), interconnect technologies (TSV, TSiCV, RDL, hybrid bonding), and thermal management constraints in AI/HPC systems.
• Ability to communicate SiC's technical value proposition (thermal conductivity, mechanical robustness, RF performance) to both engineering and executive audiences at foundries, OSATs, and chip designers.
• Proven track record in securing strategic deals, joint development programs, or long-term supply agreements with global semiconductor customers.
• Exceptional negotiation, communication, and executive relationship-building skills.
• Willingness to travel globally.
• Experience developing strategic account plans for key accounts consistent with business unit strategies.
• Ability to qualify opportunities and determine fit for SiC packaging materials across the AI chip supply chain.
• Passion for building breakthrough growth in an emerging, technically complex market.