Back Grind/Back Metal Post Fab Engineer

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

About the role

We are seeking a highly motivated engineer to join our Technology Development group as a Process Integrator focused on wafer thinning and backmetal development for new CMOS, BCD, Image Sensor, and other novel technologies. This role involves driving continuous improvement in new processes, product architecture, yield and performance enhancements, and new product/technology introduction and ramp to volume manufacturing.

Responsibilities

• Support new semiconductor technology from early development through volume manufacturing, including full documentation to support onsemi’s process change review process.
• Work with a global matrixed team while driving projects and results independently.
• Communicate effectively with all levels of the organization, including executive staff.
• Operate independently while aligning with high-level objectives.
• Collaborate as a team player with strong listening skills to make informed decisions.
• Use probe, in-line test, and failure analysis data to develop and drive process improvements.
• Drive cost reduction through yield enhancement and process simplification.
• Influence and lead decisions on capital equipment to enhance new technology capabilities and execution.

Requirements

• Demonstrated understanding of semiconductor technology, manufacturing, new product development, device, and yield improvement.
• BS in Engineering or Material Science; MS or PhD preferred.
• 6–10+ years of relevant experience in semiconductor manufacturing integration and technology development.
• Proven experience and deep knowledge of wafer thinning and back-metal processes, including bond/debond, grind, silicon wet etch, PVD, plating, TSV, and RDL.
• Experience with power semiconductors, CMOS, and BCD integration is preferred.
• Familiarity with assembly processing and advanced module construction is a plus.
• Proficiency in software tools such as MS Excel, PowerPoint, Word, MS Project, and yield analysis tools (e.g., Excensio, Spotfire, JMP, Minitab).
• Knowledge and experience with DOE, 6-sigma, Lean, model-based problem solving, 5S, 8D, SPC, and FMEA.
• Experience with predictive thermo-mechanical simulations is preferred.
• Fluent in English (written and verbal).

Benefits

onsemi offers a competitive benefits package. More details can be found here.

Pay

The base salary range for this position is $114,000 to $193,700, exclusive of fringe benefits or potential bonuses. The final pay rate will depend on geographic location, skills, education, experience, and internal equity considerations.