Jobs · Management · New York

Equipment Engineer, Bond and Grind

Wolfspeed · Marcy, NY · 2 wk ago
Management$70k–$97k/yrFull-time

Who We’re Looking For

The Equipment Engineer position at Wolfspeed is seeking a high potential, resourceful, hands-on, problem-solving professional with the capacity to quickly grasp and resolve a wide range of technical challenges. This position has an expected in-office work schedule of Tuesday-Saturday, 8am-5pm.

Day-to-Day

  • Technically adept at all things Mechanical + Electronics for various wafer processing tools such as grinders, cleaners and mounters.
  • Lead understanding of tool schematics and hardware configurations to eventually own troubleshooting and maintaining uptime on these tools.
  • Effectively use tools such as AutoCAD, Solidworks and ability to read line diagrams as well as conduct failure analysis/root cause analysis on down tools/components and design upgrade/modifications.
  • Create and modify procedures and preventative maintenance specifications to increase tool availability and enhance training procedures.
  • Partner with process engineering and production staff to improve overall quality metrics for the fab, scrap and rework reduction, and overall cost reduction.
  • Create detailed tool configuration documentation, tool acceptance specifications, and assist with tool selection for capacity increases or process development/transfer.
  • Present technical data and project updates to peers and management.

Qualifications

  • Bachelor’s degree in mechanical engineering, chemical engineering, Materials Science, Nanoscale/Microelectronic Engineering or Physics. Will also consider a degree in a relevant technical field or equivalent experience within a semiconductor environment.
  • Understanding of and ability to handle structured problem solving 5Y and 8Ds
  • MS Word, MS Excel, and MS Access experience
  • Strong written and oral communication skills
  • Strong technical aptitude

Preferred Qualifications

  • Previous experience working in an automated semiconductor fab
  • Engineering experience working with temporary bonding or wafer thinning processes

Benefits

This role may require additional duties and/or assignments as designated by management.

Pay

The posted salary range is $70,000.00 - $97,000.00. Actual pay for a hired applicant will be determined based on the individual’s job-relevant qualifications, experience, and other determinative factors.

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