Equipment Engineer, Bond and Grind
Wolfspeed · Marcy, NY · 2 wk ago
Management$70k–$97k/yrFull-time
Who We’re Looking For
The Equipment Engineer position at Wolfspeed is seeking a high potential, resourceful, hands-on, problem-solving professional with the capacity to quickly grasp and resolve a wide range of technical challenges. This position has an expected in-office work schedule of Tuesday-Saturday, 8am-5pm.
Day-to-Day
- Technically adept at all things Mechanical + Electronics for various wafer processing tools such as grinders, cleaners and mounters.
- Lead understanding of tool schematics and hardware configurations to eventually own troubleshooting and maintaining uptime on these tools.
- Effectively use tools such as AutoCAD, Solidworks and ability to read line diagrams as well as conduct failure analysis/root cause analysis on down tools/components and design upgrade/modifications.
- Create and modify procedures and preventative maintenance specifications to increase tool availability and enhance training procedures.
- Partner with process engineering and production staff to improve overall quality metrics for the fab, scrap and rework reduction, and overall cost reduction.
- Create detailed tool configuration documentation, tool acceptance specifications, and assist with tool selection for capacity increases or process development/transfer.
- Present technical data and project updates to peers and management.
Qualifications
- Bachelor’s degree in mechanical engineering, chemical engineering, Materials Science, Nanoscale/Microelectronic Engineering or Physics. Will also consider a degree in a relevant technical field or equivalent experience within a semiconductor environment.
- Understanding of and ability to handle structured problem solving 5Y and 8Ds
- MS Word, MS Excel, and MS Access experience
- Strong written and oral communication skills
- Strong technical aptitude
Preferred Qualifications
- Previous experience working in an automated semiconductor fab
- Engineering experience working with temporary bonding or wafer thinning processes
Benefits
This role may require additional duties and/or assignments as designated by management.
Pay
The posted salary range is $70,000.00 - $97,000.00. Actual pay for a hired applicant will be determined based on the individual’s job-relevant qualifications, experience, and other determinative factors.