Assembler - Weekend Shift

About the role

Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies. You will be the Microelectronic Bonder for Lockheed Martin Missiles & Fire Control in Chelmsford, MA for our weekend shift. Our team is responsible for fabricating and modifying hybrid microcircuits and sub‑assemblies that support critical defense systems.

Responsibilities

• Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies.
• Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques.
• Requires the capability to troubleshoot defective hybrids by visual or mechanical screening, wirebonds or chip placement.
• Electrically troubleshoots hybrid circuitry using an ohmmeter.
• Performs final assembly operations including attachment of feedthrough pins, soldering of coils, and mounting of substrates in special non-standard packages.
• Performs thick film screen, dry, and fire operations of various types.

Qualifications

• High school diploma or GED required.
• Ability to obtain and maintain a Secret security clearance, which requires U.S. citizenship.

Skills

• Familiarity with bonding microelectronic components and familiarity with manual gold ball and ribbon bonding.
• Familiarity with manual bonding equipment and with automatic bonding equipment.
• Basic computer skills required, including ability to navigate digital systems for timekeeping, work instructions, and task confirmation.
• Strong attention to