Advanced Packaging Photolithography Development Engineer

About the role

We are seeking a highly skilled and motivated Lithography Process Development Engineer to join our Advanced Packaging Technology Development team. In this role, you will drive lithography process development at the forefront of next-generation semiconductor packaging technology, including hybrid bonding applications. You will work in a dynamic, cross-functional environment collaborating with process integration, equipment, metrology, and design teams to enable industry-leading interconnect density and yield.

Responsibilities

• Qualify scanner/stepper platforms and Track system for backend and hybrid bonding lithography applications
• Develop, characterize, and optimize photolithography processes for back-end applications, including Cu damascene pad patterning, dielectric via and trench lithography, bonding interface layer patterning, and alignment mark / overlay target design and optimization
• Evaluate and implement underlayer stacks to address topography challenges inherent in far backend and packaging substrates
• Develop and optimize overlay metrology and control strategies critical for advanced packaging nodes
• Implement advanced process control (APC) including run-to-run (R2R) and lot-to-lot overlay feedback/feedforward control loops
• Work closely with integration and other modules to develop fully integrated process flows, ensuring lithography compatibility with upstream and downstream process steps
• Support yield learning by performing systematic defect analysis, root cause investigation, and implementing corrective actions for lithography-related yield detractors
• Contribute to technology roadmap planning for next-generation nodes and engage with equipment and material suppliers to evaluate next-generation tools and materials

Qualifications

Minimum Qualifications

• Master's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or related fields with 3+ years of relevant experience
• PhD degree in the same fields with 2+ years of relevant experience
• Experience listed above should include a combination of the following:
  • Hands-on lithography process development experience with i-line, KrF or ArF lithography process development in a semiconductor fab
  • Hands-on experience with photoresist process development, including coat/bake/develop optimization, resist profile engineering, and process window characterization
  • Strong understanding of optical lithography fundamentals: aerial image formation, resist chemistry, focus-exposure matrix (FEM), depth of focus (DOF), and exposure latitude (EL)
  • Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles

Preferred Qualifications

• Strong analytical and problem-solving skills with ability to perform systematic root cause analysis on complex, multi-variable process issues
• Experience with packaging processes, equipment automation development, or project management in technology development
• Experience in advanced packaging lithography environments (Foveros, Foveros Direct, fan-out WLP, 2.5D/3D IC, CoWoS, SoIC, or equivalent)
• Experience with overlay metrology and control, and familiarity with CDSEM and OCD/scatterometry for process monitoring and control

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Pay

Annual Salary Range for jobs which could be performed in the US: $133,800.00 - 188,890.00 USD. The range displayed reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Schedule

This role requires an on-site presence (Shift 1).