Advanced Packaging Lithography Development Manager

Key Responsibilities

• Lead and manage a team of engineers, providing clear goal setting, differentiated performance management, and coaching to foster a productive and innovative work environment
• Formulate long-term strategies for process roadmap to meet future requirements, ensuring Intel remains a leader in advanced packaging
• Foster talent development for critical technical roles, and drive technical excellence and innovation within the etch team
• Develop and execute project schedules, track milestones and deliverables, and ensure timely feedback between cross-functional teams
• Drive lithography module and segment related yield improvement initiatives and defect reduction programs
• Partner with process integration, manufacturing operations to achieve manufacturing excellence and ensure seamless technology transfer to high-volume manufacturing

Qualifications

• Minimum qualifications: Master or PhD degree in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related field. 6+ years of relevant experience with a master's degree, 5+ years or experience with a PhD degree.
• Experience listed above should include a combination of the following qualifications: Equipment Mastery: Deep expertise with scanner/stepper systems (ASML, Canon, Nikon) and/or track equipment Process Development: Extensive experience in lithography process optimization, yield enhancement, and/or manufacturing readiness Project management experience, including developing schedules, tracking deliverables, and managing cross-functional collaborations.