Thin Films Module Development Engineering

About the Role

As a Module Development Engineer, you will play a crucial role in driving advancements in Intel's semiconductor manufacturing technologies. You will focus on developing and optimizing advanced manufacturing processes to enable cutting-edge device architectures. Leveraging your expertise in process integration, equipment solutions, and feasibility studies, you will help shape Intel's future technology roadmap while ensuring robust and scalable solutions for high-volume manufacturing. Your work will directly contribute to Intel's innovation and leadership in the semiconductor industry.

Business Group

You will join Intel's Advanced Packaging Technology Development organization, which focuses on creating future generations of packaging technologies to meet Intel's manufacturing and innovation goals. This team develops and enables high-volume manufacturing processes while driving advancements in semiconductor technology to reinforce Intel's leadership position in the industry. The group ensures the successful integration of advanced technologies while delivering solutions that align with Intel's broader vision of technological innovation.

Responsibilities

• Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
• Drive technology development and enablement for both high-volume manufacturing and future technologies.
• Conduct feasibility studies and simulations to achieve desired device specifications.
• Develop and execute technology roadmaps to guide future manufacturing needs and set industry standards.
• Collaborate with equipment and material suppliers to design and implement innovative process technologies.
• Optimize production efficiency, manufacturing techniques, and output for existing and new products.
• Utilize statistical process control and data analytics to enhance process stability and drive continuous improvements.
• Recommend and implement modifications to operational equipment to improve efficiency and scalability.
• Partner with cross-functional teams to ensure alignment on process integration and project deliverables.

Qualifications

Minimum Qualifications:

• Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 5+ years of relevant experience.
• OR Master’s degree in the same fields with 3+ years of relevant experience.
• OR PhD in the same fields with 1+ years of relevant experience.
• Experience should include a combination of the following:
  • Proven expertise in manufacturing process development, statistical process control, and/or data analytics.
  • Experience in wafer-level assembly, semiconductor processing, or advanced packaging technology development.
  • Experience with films processing techniques such as CVD/PECVD, thermal/PE ALD, and PVD.

Preferred Qualifications:

• Experience in wafer-level assembly, advanced packaging, or related technologies such as hybrid bonded interconnects.
• Demonstrated success in leading programs from strategy formation to high-volume production.
• Recognized technical leadership with a proven track record of solving complex engineering challenges.
• Strong collaboration skills across functional areas like yield, operations, and supplier management.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Pay

Annual Salary Range for jobs which could be performed in the US: $133,800.00 - 255,200.00 USD. The range displayed reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Schedule

This role requires an on-site presence on Shift 1 (United States of America).

Primary Location: US, Oregon, Hillsboro.