Thin Film Development Engineer
Headway Technologies · Milpitas, CA · 3 wk ago
On-siteEngineeringFull-time
ESSENTIAL FUNCTIONS
- Develops, sustains, and supports complex thin film processes for new and prototype products
- Develops and implements novel approaches to improve and optimize TMR, CPP GMR, spin oscillator film, and low RA sensor processes
- Develops and drives the implementation of novel practices or methodologies which reduce cost and improve yield, performance, and process capability
- Conducts root cause analysis and implements corrective action if required
- Develops and implements advanced processes or procedures for transitioning new products into the production line
- Resolves process issues related to material selection; recommends corrective action
- Instructs operators and technicians on processes and procedures, including modifications to existing procedures
- Led and manages programs or projects of various size or scope; communicates and updates key stakeholders regarding project milestones and status
- Partners with equipment and maintenance personnel in order to minimize tool down time and integrate new tools into the production line
- Designs and conducts complex experiments, analyzes large volumes of data, and develops recommendations for improving the performance or reducing cost based on test results
- Responds to inquiries from other team members, managers, or departments
MINIMUM QUALIFICATIONS
- Master’s degree in Physics, Materials Science, and/or equivalent relevant experience; PhD preferred
- Three years of hands’ on experience working in the magnetic recording head, hard disk drive, or semiconductor industry in a thin film process development engineering role
- Strong knowledge and experience using JMP, SPC, or similar software
- Proficient in the use of Microsoft Office Applications
KNOWLEDGE, SKILLS, AND ABILITIES
- Strong knowledge and experience of TMR, CPP GMR, spin transfer oscillator film, and low RA sensor processes
- Strong knowledge and experience of thin film manufacturing processes, practices, and techniques
- Strong knowledge of wafer fabrication processing techniques and tools
- Strong knowledge to design experiments, analyze results, and recommend corrective action in order to reduce scrap and improve yield
- Strong knowledge to use critical thinking to resolve issues, conduct root cause analysis, and make recommendations for process improvements
- Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
- Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
- Able to work productively and collaboratively with all levels of employees and management
- Able to comply with all safety policies and procedures
- Demonstrated organizational and time management skills
- Demonstrated problem-solving and trouble shooting skills
- Flexible and able to prioritize