Thin Film Manufacturing Engineer (51714)

Description

SUMMARY:

Under the direction of the Director of Thin Film Manufacturing Engineering, the Thin Film Manufacturing Engineer is responsible for the monitoring, sustaining, and supporting day-to-day thin film manufacturing processes utilizing ion beam techniques, including providing technical support to ensure process reliability; verifying process robustness with characterization of process latitudes through experimentation; improving the efficiency of deposition and/or dry etching processes; developing and implementing practices or methodologies which reduce cost and improve operational efficiency; conducting root cause analysis and implementing corrective action; and improving production yields via process/tool manufacturability optimization.

Essential Functions

• Maintains and supports day-to-day thin film manufacturing processes, programs, and activities
• Ensures process reliability by providing technical support to operators, technicians, and other engineers
• Collaborates with development team on new thin film process integration and manufacturing process improvements
• Improves the efficiency of deposition and/or dry etching processes analyzing data, conducting experiments, and researching alternative methods which reduce scrap
• Designs and conducts experiments to verify process robustness with characterization of process latitudes
• Develops and implements practices or methodologies which lower cost, reduce cycle time, and improve operational efficiency
• Conducts root cause analysis and implements corrective action if required
• Responds to inquiries from other team members, managers, or departments
• Uses Statistical Process Control (SPC) to analyze product quality data; develops charts or reports and presents findings before groups or teams
• Adheres to all safety policies and procedures as required

Qualifications

• Minimum Qualifications: Master’s degree in Chemistry, Chemical or Electrical Engineering, Materials Science, or Physics and/or equivalent relevant experience; PhD preferred
• Three years of hands-on experience working in magnetic thin film fabrication or semiconductor industry in manufacturing or process engineering role
• Hands-on experience in SPC and Design of Experiments (DOE)
• Proficient in the use of Microsoft Office Applications

Knowledge, Skills, and Abilities:

• Strong knowledge of magnetic thin film fabrication techniques using IBE/RIE/ALD and Ion Milling technology
• Knowledge and experience of TMR, CPP GMR, spin transfer oscillator film processes
• Knowledge of surface analytical/materials characterization techniques, including XRD, AFM, TEM, SEM, and FIB
• Knowledge and experience using JMP or Excel and the ability to create macro formulas
• Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
• Able to design experiments, analyze results, and recommend corrective action
• Able to communicate effectively, both verbally and in writing, with all levels of contractors, employees, and management
• Able to work productively and collaboratively with all levels of employees and management
• Able to comply with all safety policies and procedures
• Able to use critical thinking to resolve issues, conduct root cause analysis, and make recommendations for process improvements
• Demonstrated critical thinking and analytical skills
• Demonstrated organizational and time management skills
• Demonstrated problem-solving and trouble shooting skills
• Flexible and able to prioritize

Work Conditions

The Thin Film Manufacturing Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask. May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of workday; may be exposed to loud noise. Stands, walks, bends, and twists. Performs various fine grasping movements; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 30 pounds.