Thermal Mechanical Engineer

Job Summary

The system engineering department is hiring a thermal mechanical engineer. You will be responsible for performing structural and thermal simulations to optimize the design of electro-optical sub-assemblies. Your work will directly impact on the performance and reliability of our quantum computer sub-systems.

Responsibilities

• Develop detailed FEA/CFD models of components, packages, optical-electronic modules, and system-level assemblies using appropriate simulation tools such as ANSYS, COMSOL, or equivalent platforms.
• Correlate FEA results with experimental measurements, prototype test data, and hardware observations to improve model fidelity and support simulation-driven design decisions.
• Perform warpage and deformation analysis for multi-material assemblies, accounting for mismatch in thermal expansions, nonlinear material behavior, temperature gradients, and boundary conditions.
• Develop thermal cycling and mechanical fatigue models to predict long-term reliability, including creep, stress relaxation, and interface degradation.
• Identify mechanical risk drivers and recommend design, material, or process changes to improve robustness, manufacturability, and yield.
• General design activities such as requirements management, materials and component selection, Design Failure Modes and Effects Analysis (FMEA), and tolerance analyses.
• Develop end-to-end simulation workflows to automate processes, assess performance across diverse operating scenarios, documentation, and tools to improve efficiency, accuracy, and repeatability.
• Analyze failures related to electro-optical assembly design and providing solutions.

Experience/Qualifications

• M.Sc., or Ph.D in Mechanical Engineering, Electrical Engineering and Physics or related field.
• 5+ years of hands-on modeling and simulation experience in the semiconductor industry.
• Strong understanding of thermal conduction and convective heat transfer methodologies.
• Deep knowledge of solid mechanics principles, including stress, strain, fatigue, creep, constitutive models of elastic, visco-plastic, and plastic materials.
• Proficiency with simulation tools such as ANSYS (Mechanical, Icepak and Fluent), COMSOL, or equivalent, including nonlinear and transient analyses.
• Working knowledge of lab-scale validation techniques.

Desired Skills/Experience

• Experience with Ansys AEDT and Ansys Sherlock.
• Understanding advanced semiconductor packaging, solder joints, and reliability modeling techniques.
• Knowledge of common optical system specifications and optical component specifications.
• Exposure to SOC thermal mechanical analysis.
• Exposure to optical structural analysis.