Technologist, Packaging Engineering

About the role

We are seeking a detail-oriented and analytical Technologist, Packaging Engineering to join our team in Milpitas, United States.

Responsibilities

• Serve as the senior Package Engineering representative on cross-functional leadership teams, setting technical direction and ensuring packages are fully characterized, qualified, and released to production on schedule while meeting stringent mechanical, electrical, performance, reliability, and quality requirements.
• Provide end-to-end ownership of the package lifecycle across design, development, qualification, and manufacturing, driving alignment among cross-functional engineering teams, global factories, and key stakeholders.
• Lead global engagement with factories and contract manufacturers to enable robust, scalable, and cost-effective high-volume introduction of new package designs and advanced assembly processes.
• Partner with Packaging R&D organizations worldwide to define, develop, and qualify next-generation and emerging packaging technologies in alignment with long-term business strategy and product roadmaps.
• Drive enterprise-level assembly yield improvement initiatives and package cost-reduction programs, establishing best practices and measurable performance targets across supported product lines.
• Own package technology roadmaps, oversee budgets for supported products, and guide the development of scalable packaging infrastructure to support future growth and technology transitions.
• Lead new products through the transition from low-volume to high-volume manufacturing, ensuring yield, quality, and reliability objectives are achieved.
• Establish and enforce readiness of FMEA, SOD, Control Plans, process recipes, SPC, and other critical assembly controls prior to high-volume production.
• Provide technical leadership in evaluating and validating design options through characterization builds and comprehensive DFX (Design for excellence) analyses, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), influencing product architecture and manufacturing strategy at the system level.

Qualifications

• Master’s degree or PhD in Material Science, Manufacturing, Mechanical Engineering, Computer Science, Physics or other engineering disciplines.
• Minimum 10 years of relevant work experience with a Master's degree, or 8+ years of experience with a PhD.
• Proficient understanding of packaging domains including SMT, PCBA, solder joint reliability, board-level reliability, packaging materials, failure analysis, and PCB layout.
• Additional expertise in die attach, wire bonding, wafer thinning, and molding processes is a plus.

Skills

• Strong problem-solving skills with demonstrated expertise in experimental design and statistical analysis.
• Excellent written and verbal communication skills with the ability to collaborate effectively with global cross-functional teams.
• Knowledge of thermo-mechanical aspects of semiconductor packages and Solid-State Drives.
• Assist in developing and maintaining the Package Technology Roadmap, working with global assembly, and packaging teams.
• Demonstrated experience mentoring or managing junior engineers is a plus.
• Continuously track major industry benchmark announcements in packaging and proactively build organizational awareness of competitive and emerging benchmark strategies.
• Familiarity with industry benchmarking trends and packaging technology roadmap development.

Benefits

Compensation & Benefits Details

• An employee’s pay position within the salary range may be based on several factors including but not limited to (1) relevant education; qualifications; certifications; and experience; (2) skills, ability, knowledge of the job; (3) performance, contribution and results; (4) geographic location; (5) shift; (6) internal and external equity; and (7) business and organizational needs.
• The salary range is what we believe to be the range of possible compensation for this role at the time of this posting. We may ultimately pay more or less than the posted range and this range is only applicable for jobs to be performed in California, Colorado, New York or remote jobs that can be performed in California, Colorado and New York. This range may be modified in the future.
• You will be eligible to participate in Sandisk's Short-Term Incentive (STI) Plan, which provides incentive awards based on Company and individual performance. Depending on your role and your performance, you may be eligible to participate in our annual Long-Term Incentive (LTI) program, which consists of restricted stock units (RSUs) or cash equivalents, pursuant to the terms of the LTI plan.
• RSU awards are also available to eligible new hires, subject to Sandisk's Standard Terms and Conditions for Restricted Stock Unit Awards.
• We offer a comprehensive package of benefits including paid vacation time; paid sick leave; medical/dental/vision insurance; life, accident and disability insurance; tax-advantaged flexible spending and health savings accounts; employee assistance program; other voluntary benefit programs such as supplemental life and AD&D, legal plan, pet insurance, critical illness, accident and hospital indemnity; tuition reimbursement; transit; the Applause Program, employee stock purchase plan, and the Sandisk's Savings 401(k) Plan.