Technical Program Manager III

Ascendion is an AI‑native software engineering disruptor helping businesses innovate faster, smarter, and with greater impact. The company partners with enterprise clients across North America, the UK, Europe, and APAC to solve complex challenges in data, experience design, software product engineering, and workforce transformation. Powered by expert engineers, thousands of AI agents, and its Engineering to the Power of AI (EngineeringAI) method, Ascendion delivers measurable outcomes that build trust, unlock value, and accelerate growth.

About the Role

This role supports a business group focused on developing next‑generation Augmented Reality (AR) wearable devices. The team drives innovation in flexible and rigid circuit board design, enabling advanced features in compact form factors. The position offers exposure to advanced manufacturing processes and a pivotal role in bringing innovative devices to market.

Key Responsibilities

• Direct ownership of design releases for flexes and multi‑layer boards (MLBs) from early design through production.
• Collaborate with electrical engineers and cross‑functional teams to develop flexible circuits and rigid circuit boards.
• Gather feedback, track schedules, and highlight risks throughout the development process.
• Manage SMT (Surface Mount Technology) and FATP (Final Assembly, Test, and Pack) builds end‑to‑end, optimizing for schedule, quality, and yield.
• Engage directly with APAC contract manufacturers, ensuring supplier readiness and managing flex vendor relationships.

Minimum Qualifications

• Bachelor’s degree in Electrical Engineering (required).
• 5+ years in electrical design, PCB development, or related hardware engineering roles.
• Direct ownership of design releases for flexes and MLBs from early design through production.
• Experience managing SMT and FATP builds end‑to‑end, including schedule, quality, and yield optimization.
• Hands‑on APAC contract manufacturer management, including flex vendor engagement and supplier readiness.
• Familiarity with small electrical component integration in compact form factors.
• Knowledge of advanced PCB fabrication techniques and materials.

Preferred Qualifications

• Master’s degree in Electrical Engineering (preferred).
• 10+ years of experience in electrical design, printed circuit board (PCB) development, or related hardware engineering roles.
• Experience with AR wearable device development.
• Prior experience at FAANG or other large‑tech companies.

Location

Sunnyvale, CA – onsite.

Pay

The salary range for this position is $145,600 – $203,528 annually. Compensation within this range may vary based on geography/market, skills, education, experience, and other qualifications.

Benefits

• Medical insurance
• Dental insurance
• Vision insurance
• 401(k) retirement plan
• Long‑term disability insurance
• Short‑term disability insurance
• 5 personal days accrued each calendar year (paid time off meets applicable sick and safe‑time laws)
• 10‑15 days of paid vacation time
• 6 paid holidays plus 1 floating holiday per calendar year
• Access to the Ascendion Learning Management System