Systems Architect for High-Performance Systems

About the role

The successful candidate will lead the design and development of high-performance hardware systems tailored for AI and HPC workloads. They will collaborate with thermal and mechanical teams to ensure seamless technology integrations and drive innovation in power delivery, signal integrity, and thermal solutions.

Responsibilities

• Provide thought leadership in designing scalable, reliable, and high-performance hardware architectures.
• Define system-level requirements across electrical, thermal, and mechanical domains and translate them into robust reference designs.
• Collaborate cross-functionally with thermal and mechanical teams to ensure seamless technology integrations.
• Architect systems optimized for AI and HPC environments, targeting GPU, TPU, IPU, and other accelerator-based platforms.
• Define and manage signaling budgets across chips using SerDes, retimers, and linear amplifiers for ultra-high-speed data paths (112 Gbps-PAM4, 224 Gbps-PAM4).
• Drive innovation in power delivery, signal integrity, and thermal solutions to meet demanding performance targets.
• Serve as a subject matter expert in SerDes performance, retimer/redriver technologies, and complex hardware systems.
• Participate in design reviews and promote best practices across engineering teams.
• Mentor junior engineers and foster a culture of technical excellence.
• Stay current with emerging technologies, tools, and methodologies to enhance system performance.
• Identify bottlenecks and propose optimizations based on industry experience and benchmarking.

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
• 10+ years of experience in hardware design and architecture for high-performance systems.
• Deep expertise in power delivery, signal integrity, and thermal management.
• Proven experience with SerDes, retimers, and linear amplifiers at 112 Gbps-PAM4 and higher.
• Strong collaboration and communication skills across multidisciplinary teams.
• Proficiency in PCB layout, CAD tools, and electromagnetic simulation (e.g., HFSS).
• Strong analytical and troubleshooting skills for complex multi-domain issues.

Qualifications

• Experience designing and scaling hardware for AI inference and training workloads.
• Familiarity with advanced packaging technologies.
• Hands-on experience with switch ICs and AI accelerators (GPU, TPU, IPU).

Skills

• System Architecture & Design
• High-Performance Hardware Development
• Technical Leadership & Mentorship
• Innovation & Optimization

Benefits

This role is eligible for variable pay, issued as a monetary bonus or in another form. Specific eligibility criteria is set by the applicable Summary Plan Description, policy or guideline and benefits may vary by geographic region.

Pay

$150,000 - $200,000 per year

Schedule

TBD