Staff Mechanical Design Engineer

About the role

We are seeking a Staff Mechanical Design Engineer to join our Advanced Technology Infrastructure team. This role focuses on delivering mechanically robust, tolerance aware, and production ready designs that enable reliable electrical and thermal systems for next generation high power XPU and Silicon Photonics platforms.

Responsibilities

• Own mechanical design and CAD development of test sockets, thermal heads, pedestals, handler design and loading mechanisms for high-power semiconductor validation platforms
• Participate in tolerance stack-up analysis, managing TIM bond-line thickness (BLT) and contact stack compliance to prevent die cracking, excessive contact resistance, and reliability degradation
• FAU design, CPC connector design, Silicon Photonics Test infrastructure development
• Develop compliant mechanical designs, including springs, flexures, and preload structures, to absorb socket manufacturing tolerances and handler misalignment
• Design socket-to-thermal-head integration features, ensuring precise alignment, mechanical stability, and repeatable contact under dynamic loading
• Design manufacturable internal fluid geometries, including micro-channels and jet-impingement manifolds, in collaboration with thermal engineering teams
• Reduce DPPM through mechanical precision, owning pedestal planarity, flatness, and uniform pressure mapping across the device interface
• Perform manufacturing-focused tolerance and variation analysis, identifying sensitivity drivers and defining robust design margins
• Integrate multi-zone heaters, sensors, and wiring paths within compact assemblies while maintaining serviceability and mechanical integrity
• Select CTE-matched materials for sockets, pedestals, and structural components to minimize package and fixture warpage across temperature excursions
• Develop modular, scalable CAD architectures and reusable design kits to enable rapid customization and high-volume manufacturing deployment
• Drive Design for Manufacturability (DFM) optimization, ensuring complex evaporator and fluid-integrated geometries are cleanable, inspectable, and mass-producible
• Partner with manufacturing, reliability, and supply-chain teams to define build processes, inspection methods, and production readiness criteria
• Interface with external vendors on machining, surface finishing, coatings, and precision component fabrication
• FAU design, CPC connector design, Silicon Photonics Test infrastructure development

Requirements

• Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 3-5 years of related professional experience
• Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 2-3 years of experience or equivalent professional experience in lieu of a formal degree
• Strong mechanical design experience in precision hardware, semiconductor test infrastructure, or high-tolerance assemblies
• Demonstrated expertise in tolerance stack-up, compliant mechanisms, and mechanical interface design
• Proficiency with 3D CAD tools (e.g., NX, SolidWorks, Creo, or equivalent) and drawing standards preferred
• Solid understanding of materials, CTE mismatch, contact mechanics, and manufacturability constraints
• Experience working closely with thermal engineers and fluid-based cooling designs preferred
• Ability to translate complex requirements into clear mechanical architectures and detailed designs
• Strong communication skills and comfort leading technical discussions across disciplines
• Experience with semiconductor test sockets, handlers, or thermal head assemblies preferred
• Familiarity with high-volume manufacturing and DPPM-driven quality programs preferred
• Exposure to fluid-integrated mechanical designs and precision machining limitations preferred
• Experience supporting prototype bring-up, lab validation, and production ramp preferred
• Prior leadership on cross-program platform or infrastructure designs preferred

Qualifications

• Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 3-5 years of related professional experience
• Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 2-3 years of experience or equivalent professional experience in lieu of a formal degree

Skills

• Strong mechanical design experience in precision hardware, semiconductor test infrastructure, or high-tolerance assemblies
• Demonstrated expertise in tolerance stack-up, compliant mechanisms, and mechanical interface design
• Proficiency with 3D CAD tools (e.g., NX, SolidWorks, Creo, or equivalent) and drawing standards preferred
• Solid understanding of materials, CTE mismatch, contact mechanics, and manufacturability constraints
• Experience working closely with thermal engineers and fluid-based cooling designs preferred
• Ability to translate complex requirements into clear mechanical architectures and detailed designs
• Strong communication skills and comfort leading technical discussions across disciplines
• Experience with semiconductor test sockets, handlers, or thermal head assemblies preferred
• Familiarity with high-volume manufacturing and DPPM-driven quality programs preferred
• Exposure to fluid-integrated mechanical designs and precision machining limitations preferred
• Experience supporting prototype bring-up, lab validation, and production ramp preferred
• Prior leadership on cross-program platform or infrastructure designs preferred

Benefits

• Employee stock purchase plan with a 2-year look back
• Family support programs to help balance work and home life
• Robust mental health resources to prioritize emotional well-being
• A recognition and service awards to celebrate contributions and milestones

Pay

Expected Base Pay Range (USD): $100,300 - $150,200, $ per annum

Schedule

The schedule for this role is not specified.