SoC Physical Design Engineer, Senior Member of Technical Staff (SMTS)

About the role

The successful candidate will be part of the Heterogeneous Integration Group (HIG) at Micron Technology, a global leader in memory and storage solutions. They will be responsible for driving the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII, collaborating with various teams to ensure robust signoff collateral for tapeout.

Responsibilities

• Own physical implementation for SoC blocks and/or top-level, including floor planning, placement, CTS, routing, and physical optimization to meet PPA targets.
• Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs.
• Collaborate with design and integration teams to ensure clean implementation of clocking/reset strategy, power architecture, and SoC integration requirements.
• Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY-adjacent logic) with focus on robust physical integration and timing/power integrity.
• Perform and/or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, addressing violations efficiently.
• Work with packaging, assembly, test, probe, and manufacturing stakeholders to ensure design meets manufacturability and quality requirements.
• Support tapeout execution (checklists, ECO flows, signoff reviews) and contribute to post-silicon debug by correlating silicon behavior with PD/STA/power analysis.
• Identify flow gaps and improve productivity through scripting/automation and best-practice methodology development.

Requirements

• Strong experience in SoC physical design implementation from netlist to GDSII on advanced nodes and complex designs.
• Proficiency with industry EDA tools (e.g., Cadence Innovus/Tempus, Synopsys ICC2/PrimeTime, Siemens Calibre or equivalent).
• Experience with power intent and power delivery considerations (e.g., UPF/CPF concepts, power grid planning, power gating implications).
• Exposure to hierarchical physical design, top-level assembly, partitioning guidelines, and large-scale integration methodology.
• Knowledge of IR/EM analysis, noise, coupling/crosstalk considerations, and mitigation strategies.
• Proven tapeout history on advanced foundries (e.g., TSMC) and understanding of full-cycle SoC development flows.
• Strong scripting/automation skills using Python, TCL, Perl, and/or shell.

Preferred Qualifications

• Experience with HBM / DRAM adjacent SoC designs, or memory-subsystem-heavy SoCs.
• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
• Minimum 15 years of experience in a related field.

Pay

The US base salary range that Micron Technology estimates it could pay for this full-time position is: $177,000.00 - $334,000.00 a year. Additional Compensation May Include Benefits, Bonuses And Equity. Our salary ranges are determined by role, level, and location.