SI/PI Tech Project Manager

About the role

Broadcom is seeking an experienced SI/PI Technical Project Manager to lead a team of engineers designing complex flip-chip-BGA packages, PCBs, and system channel links for industry-leading ASICs with high-speed SerDes and very-high-power-delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs in artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 448G and higher, Optics, 5G RF/Microwave ADC/DAC, HBM, DDR5, and more.

Responsibilities

• Navigate and track project plans for 20+ concurrent package/PCB designs (scope, schedules, resources) from a technical execution standpoint.
• Understand the skill sets and traits of each team member to maximize productivity and retention.
• Organize team and customer activities to keep projects on track.
• Clearly and concisely communicate plans, status, next steps, and risks on a regular basis.
• Create technical methodologies for signal and power integrity solutions.
• Support package and PCB technologies with input from team members.
• Collaborate with customers, vendors, and cross-functional teams.

Requirements

• BSEE and 12+ years of experience in ASIC and system signal and power integrity for high-speed SerDes.
• Minimum of 3 years in leadership/management.
• Knowledge of package-level, PCB-level, and/or system-level signal integrity and power integrity.
• Experience cooperating with worldwide teams (multiple time zones), including co-design with internal and external (vendor) designers.
• Self-management, organization, and clear communication skills.

Technical Skills

• SI/PI EDA extractions and simulations.
• System-level SerDes channel results.
• Lab measurements (passive and active) and correlation efforts.
• Lab equipment needs and management.
• Package and PCB lifecycle and design flows.
• Understanding of how the substrate and package fit into the overall system implementation and trade-offs to support customers effectively.
• Design data, including how it is created and utilized (e.g., package: .mcm, package spreadsheet, drawings like POD, Lid, Substrate).
• Automation code development.
• Project management.

Other Requirements

This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position. The role is deeply collaborative and requires direct, real-time engagement with lab equipment and face-to-face team co-design.

Pay

The annual base salary range for this position is competitive and will be discussed during the interview process.

Benefits

• Discretionary annual bonus and opportunity to receive new hire equity grant plus annual equity awards.
• Comprehensive benefits package including medical, dental, and vision plans.
• 401(K) participation with company matching.
• Employee Stock Purchase Program (ESPP).
• Employee Assistance Program (EAP).
• Paid holidays, sick leave, and vacation time.
• Paid Family Leave and other leaves of absence in accordance with applicable laws.