Senior Yield & Integration Engineer

Responsibilities

• Oversee wafer foundry yield management by establishing yield monitoring frameworks, analyzing inline, parametric, and final test data to identify yield loss mechanisms
• Lead root cause investigations into yield excursions across fabrication, assembly, and test
• Collaborate closely with foundry partners and internal process integration, device, and reliability teams to drive corrective actions, optimize process windows, and deliver sustained yield improvement and cost reduction
• Analyze yield loss mechanisms impacting key detector metrics
• Drive root cause analysis using advanced tools and techniques
• Correlate physical defects to electrical, thermal, and optical performance impact
• Own and optimize integrated process flows
• Ensure compatibility and robustness across front-end, MEMS, and back-end processes
• Support technology transfers and manufacturing ramp of new IR detector designs
• Data Analytics & Performance Correlation
• Correlate process data with thermal imaging performance metrics and test results
• Perform advanced yield and performance analysis using JMP, Python, SQL, or MATLAB
• Develop yield dashboards, defect Pareto analyses, and predictive indicators for yield risk
• Cross-functional Technical Leadership
• Partner closely with device design and modeling teams, ROIC and electronics engineering
• Interact reliability, packaging, and test engineering
• Interface with equipment vendors, material suppliers, and external foundries on yield and integration issues
• Support customer-facing root cause investigations and continuous improvement efforts
• Mentorship & Continuous Improvement
• Mentor junior yield and integration engineers in IR-specific failure analysis and yield methodologies
• Lead multi-disciplinary improvement projects using Lean and Six Sigma tools
• Define best practices, documentation standards, and yield control plans for manufacturing

Requirements

• Familiarity with electronic circuit functionality (schematics, functional elements, etc.)
• Microbolometer MEMS fabrication
• Insight to wafer foundry functionality and process integration
• Vacuum technology: concepts, materials, and equipment
• Familiarity with photolithography processes and equipment
• ROIC-to-detector hybridization
• Wafer bonding, dicing, and release steps
• Strong understanding of MEMS processing, thin films, and wafer-level integration
• Photolithography
• Wafer photo pattern strips & cleans
• CMP, Etch, Lift-off
• PEDV, PVD, E-Beam
• Expertise in SPC, DOE, and yield analytics
• Hands-on experience with AOI, SEM, EDX, FIB, FTIR

Qualifications

• M.S. or equivalent in a STEM field- Will consider work equivalent work experience
• 7+ years of experience in yield engineering, process integration, or device engineering
• Direct experience with infrared detectors, thermal imaging systems, microbolometers, or MEMS devices
• Must be US Citizen or PERM Resident