Jobs · Washington

Senior Silicon Design Engineer

Microsoft · Redmond, WA · 4 days ago
Hybrid$120k–$235k/yrFull-time

Responsibilities

  • Part of the design team driving high performance, high bandwidth Network-on-Chip designs in the start-of-the-art AI SoCs.
  • Work on Intellectual Property (IP) microarchitecture specification.
  • RTL design, synthesis/Lint/CDC/FEV, and System on Chip (SOC) integration on different subsystems.
  • Interact with various teams, including architecture, verification, and physical design, ensuring the design is implemented and verified to the spec.

Qualifications

  • Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 1+ year(s) technical engineering experience
  • Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience
  • Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 5+ years technical engineering experience
  • Equivalent experience.

Other Requirements

  • Ability to meet Microsoft, customer and/or government security screening requirements.

Preferred Qualifications

  • 4+ years of experience delivering successful IP or Application Specific Integrated Circuits (ASIC)/SOC designs.
  • 4+ years expertise in Digital Design including microarchitecture specification development, RTL coding in Verilog/System Verilog and Clock Domain Crossing (CDC)/LINT closure.
  • 4+ years of experience in Synthesis, Timing constraints, Power, Performance, Area (PPA) trade-offs and Post-Silicon Debug.
  • 4+ years of experience with Synthesis, Standard Design Constraints (SDC) and Unified Power format UPF.
  • 4+ years of experience working on SOC integration.
  • Experience with industry standard interfaces such as Advanced extensible Interface (AXI), APB, JTAG.
  • Experience with writing System Verilog assertions and coverpoints.
  • Experience with scripting languages such as Perl or Python.
  • Track record of successful tapeouts in deep sub-micron technologies.
  • Communication skills and the ability to facilitate collaboration across Microsoft internal groups and external vendors.
  • Ability and willingness to adapt and work on variety of designs.

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