Senior Packaging Technical Engineer - Hardware
About the role
Our dynamic work environment demands proactive ownership, as you’ll play a key role in driving technology across multiple functions. In this position, you’ll be responsible for crafting and implementing silicon pad rings, as well as working with a variety of package technology types and complex technologies. This is not just another engineering role—it’s a unique opportunity that actively encourages innovative, out-of-the-box problem solvers to contribute and shape the future of our technology.
Responsibilities
- Define and implement the chip pad ring, substrate interconnect scheme, and lead the package layout design process.
- Collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout, and system design Engineers and Managers.
- Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package.
- Communicate effectively with various teams throughout the company.
Requirements
- BSEE or equivalent experience.
- Minimum of 8+ years in board/system design. Experience with package design is preferred.
- Good understanding of transmission line theory, power delivery, and signal integrity is desired.
- Programming and scripting skills in Perl, Python, Tcl are desired; Cadence Skill and Excel familiarity are useful and a plus.
- Hardworking and able to work with a minimum of supervision.
- You seek to solve complex technical problems.
Benefits
NVIDIA offers highly competitive salaries and a comprehensive benefits package. See what we can offer to you and your family at www.nvidiabenefits.com.
Pay
Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is:
- 168,000 USD - 258,750 USD for Level 4
- 200,000 USD - 322,000 USD for Level 5
You will also be eligible for equity and benefits.