Senior Packaging Technical Engineer - Hardware

Remote – US based candidates only, no visa sponsorship available.

About the role

This role will lead technical initiatives focused on scalable systems, platform reliability, and meaningful business transformation. You will work across engineering, product, operations, and business stakeholders to translate complex requirements into practical technology solutions. The position offers the opportunity to influence architecture, execution quality, and the technology capabilities that enable long-term growth within a Telecommunications & Hardware environment.

Responsibilities

• Define and implement chip pad ring and substrate interconnect schemes
• Lead the package layout design process with collaboration across various engineering teams
• Define chip floor plan, pad ring, substrate, and ball out for robust packaging
• Communicate effectively with team members across the organization to ensure alignment

Requirements

• BSEE or equivalent experience
• 8+ years of experience in board/system design; package design preferred
• Strong understanding of transmission line theory and signal integrity required
• Proficiency in programming/scripting in Perl, Python, Tcl; Cadence Skill and EXCEL knowledge preferred
• Ability to work independently with minimal supervision
• A proactive approach to solving complex technical issues

Pay

$168,000 – $322,000 annually

Benefits

• Comprehensive benefits package for employees and their families
• Equity options as part of the compensation package
• Access to a highly competitive salary based on experience and location