Senior Packaging Development Engineer

About the role

We're seeking a talented and driven Packaging Development Engineer to lead the development of next-generation packaging solutions. This role involves leading next generation Silicon Photonics package design, optimizing electrical assembly and RF signal efficiency, and ensuring seamless transition to mass production.

Responsibilities

• Lead next generation Silicon Photonics package design in collaboration with cross-functional teams, stakeholders and vendors to ensure package requirements are met.
• Owning all the development of all the advanced packaging activities and designs: flip chip, reflow, fanout, thermo-compression bonding, underfill, hot bar soldering, wirebonding, etc...
• Optimize the assembly of electrical and optical engines and apply Design for Manufacturing principles to meet production volumes and cost targets.
• Survey advanced SiPh packaging solutions, materials and vendors to stay current with new technological advancements.
• Own and maintain the process and the manufacturing documentation, along with Bill of Materials for new products.
• Drive package debug activities during product validation and qualification.
• Support the development activities at our Contract Manufacturers, both remotely and on-site to ensure a smooth transition to mass production.

Requirements

• 5-8 years of experience in high-speed electronics and Silicon Photonics package design.
• Experience with flip chip, fanout, thermo-compression bonding, underfill, hot bar soldering, wirebonding, die attach.
• Knowledgeable in packaging technologies and processes, with glass/ceramic/metal material properties and multilayer materials interfaces after bonding.
• Experience in high-volume packaging of optical transceivers, co-packaged optics, multi-chips module, pluggables, 2.5/ 3D packages.
• Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
• Experience with package and process design/development from design to production.
• Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience.

Qualifications

• Familiar with optical coupling, fiber pigtail and free space optics.
• Knowledgeable in materials properties and process, yield analysis and enhancement, failure mode and analysis, quality tools (such as DOE, SPC and Six-Sigma process and analysis).
• Familiar with industry test standard, such as JEDEC, EIA, Telcordia, Mil-Std, etc.
• Knowledge of material properties and associated mechanical part fabrication processes.

Skills

• Strong interpersonal, communication and problem-solving skills.
• Experience with package and process design/development from design to production.
• Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience.

Benefits

Our benefits include a Corporate Retirement Savings Plan, Health and dental benefits, Short-term disability, and long-term disability, Life insurance, and AD&D – Company paid 2x base pay, Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child), Paid time off for holidays and Vacation, Employee Stock Purchase Plan, Tuition Assistance Plan, Adoption assistance, Employee Assistance Program/Work Life Resource Program.

Pay

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.

Schedule

Check the salary ranges in the job info section for this role.