Senior Package Layout Engineer - Hardware

About the role

Collaborate with the Technical Package Lead and various design teams to design and develop sophisticated, detailed layout of IC substrates for NVIDIA products. Work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues.

Responsibilities

• Implement high speed/density ASIC packages as part of a Layout team.
• Perform substrate breakout patterns for ASIC packages.
• Optimize package pinout incorporating system-level trade-offs of pin assignment.
• Perform package routing, placement, stack-up, reference plane, and power distribution using Cadence APD or SiP tool suite.
• Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
• Conduct design feasibility studies to evaluate package design goals for size, cost, and system performance.
• Develop symbols and CAD library databases using Cadence APD design tools.
• Develop methodologies to improve layout productivity.

Requirements

• B.S. in Electrical Engineering or equivalent experience.
• 5+ years of experience in PCB Layout of graphics cards, motherboards, line cards, or other related technology. Experience with HDI designs is a plus.
• Proven experience in substrate layout of wire bond and flip chip packages.
• Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager).
• Solid understanding of high-speed design signal integrity practices.
• Experience with Virtuoso and Calibre is a plus.
• Experience using Valor is helpful.

Pay

Base salary range: $136,000 – $212,750 USD for Level 3, and $168,000 – $258,750 USD for Level 4. Eligible for equity and benefits.