Senior Package Layout Engineer - Hardware

About the role

NVIDIA is seeking a hard-working Senior Package Layout Engineer to collaborate with the Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. This position also works with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues.

Responsibilities

• As part of a Layout team, collaborate to implement high speed/density ASIC packages.
• Perform substrate breakout patterns for ASIC packages.
• Optimize package pinout incorporating system level trade-offs of pins assignment.
• Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
• Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
• Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
• Develop symbols and CAD library databases using Cadence APD design tools.
• Develop methodologies to improve layout productivity.

Requirements

• Hold a B.S. Electrical Engineering or equivalent experience.
• 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology.
• Experience with HDI designs is a plus.
• Proven experience in substrate layout of wire bond and flip chip packages, preferred.
• Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager).
• Solid understanding of high-speed design signal integrity practices.
• Experience with Virtuoso and Calibre is a plus.
• Experience using Valor is helpful.

Benefits

• Equity
• Benefits package

Pay

• Base salary range: 136,000 USD - 212,750 USD for Level 3
• Base salary range: 168,000 USD - 258,750 USD for Level 4