Senior Package Layout Engineer - Hardware

About the role

Join NVIDIA in designing sophisticated IC substrates for our world-leading GPUs and SOCs. Collaborate with the Technical Package Lead and cross-functional design teams to deliver high-performance, high-density ASIC packages while resolving cost, manufacturing, and electrical design challenges.

Responsibilities

• Implement high-speed, high-density ASIC package layouts as part of a dedicated Layout team.
• Create substrate breakout patterns for ASIC packages.
• Optimize package pinout, incorporating system-level trade-offs for pin assignment.
• Perform package routing, placement, stack-up, reference plane, and power distribution using Cadence APD or SiP tool suite.
• Propose and evaluate layout design trade-offs for resolution with the Technical Package Lead.
• Conduct feasibility studies to assess package design goals for size, cost, and system performance.
• Develop symbols and CAD library databases using Cadence APD design tools.
• Create methodologies to enhance layout productivity.

Requirements

• Bachelor’s degree in Electrical Engineering or equivalent experience.
• 5+ years of experience in PCB layout for graphics cards, motherboards, line cards, or related technologies (HDI design experience is a plus).
• Proven experience in substrate layout for wire bond and flip chip packages (preferred).
• Strong proficiency with Cadence APD or SiP and/or PCB layout tools, including Constraint Manager.
• Solid understanding of high-speed design and signal integrity practices.
• Experience with Virtuoso and Calibre is a plus.
• Familiarity with Valor is helpful.

Pay

Base salary ranges: $136,000 – $212,750 USD (Level 3) or $168,000 – $258,750 USD (Level 4), depending on experience and location. Eligible for equity and benefits.