Senior Package Design Engineer – Semiconductor Packaging
Job Details
We are a leading AI semiconductor company developing high-performance computing technology that is redefining the future of artificial intelligence. Our engineering teams are building advanced processors, software platforms, networking solutions, and semiconductor technologies from the ground up while fostering a highly collaborative environment focused on innovation and solving technically demanding challenges.
Why Join Us?
Work on some of the industry's most advanced AI semiconductor programs. Collaborate directly with world-class silicon, package, SI/PI, and systems engineers. Gain exposure to emerging packaging technologies including chiplets and 2.5D integration. Influence package architecture during early design phases rather than production support. Join a rapidly growing engineering organization tackling next-generation computing challenges.
Job Description
- Create PCB routing studies supporting package development
- Develop board-level design mockups for electrical modeling
- Perform package escape routing and BGA optimization studies
- Analyze routing congestion and layer utilization
- Support Signal Integrity and Power Integrity modeling
- Build representative PCB environments for package evaluation
- Collaborate with package, SI/PI, mechanical, and systems engineering teams
- Evaluate design tradeoffs during early architecture phases
- Contribute automation and workflow improvement initiatives
- Support advanced package-board co-design activities
Requirements
- 3+ years using Cadence Allegro PCB Designer
- Experience with high-pin-count BGA layouts
- Strong PCB routing expertise
- Understanding of package escape strategies
- Knowledge of Signal Integrity fundamentals
- Knowledge of Power Integrity fundamentals
- Experience with complex, high-speed interconnects
- Strong cross-functional communication skills
- Comfortable working through ambiguous engineering challenges
- Interest in AI-driven engineering automation
What You Will Be Doing
- Create PCB routing studies supporting package development
- Develop board-level design mockups for electrical modeling
- Perform package escape routing and BGA optimization studies
- Analyze routing congestion and layer utilization
- Support Signal Integrity and Power Integrity modeling
- Build representative PCB environments for package evaluation
- Collaborate with package, SI/PI, mechanical, and systems engineering teams
- Evaluate design tradeoffs during early architecture phases
- Contribute automation and workflow improvement initiatives
- Support advanced package-board co-design activities
Must Have Skills
- 3+ years using Cadence Allegro PCB Designer
- Experience with high-pin-count BGA layouts
- Strong PCB routing expertise
- Understanding of package escape strategies
- Knowledge of Signal Integrity fundamentals
- Knowledge of Power Integrity fundamentals
- Experience with complex, high-speed interconnects
- Strong cross-functional communication skills
- Comfortable working through ambiguous engineering challenges
- Interest in AI-driven engineering automation
Salary
$150,000 - $300,000 per year
Location
Santa Clara, CA • Hybrid • Minimal travel