Senior Heterogenous Integration Process Engineer

Job Description

TEL Technology Center, America (TTCA) is a leading R&D center focused on developing next-generation semiconductor process technologies and equipment solutions. The 3DI Technology Group at TTCA specializes in advanced packaging, heterogeneous integration, and 3D device integration, working closely with customers, research institutions, and TEL's global R&D network.

Group/Role Overview

The 3DI Technology Group at TTCA develops innovative solutions for future semiconductor applications, including bonded-CFET, VCT DRAM, and 3D-stacked memory and logic devices. As a 3DI R&D Engineer, you will lead the development of process and equipment solutions through fundamental research, process development, and technology pathfinding.

Responsibilities

• Lead R&D programs in advanced 3DI technologies, including C2W, D2W, and wafer bonding.
• Define technical strategy and align R&D activities with business objectives.
• Collaborate with global teams, customers, and joint development partners.
• Conduct fundamental research and develop innovative processes and hardware solutions.
• Evaluate technology feasibility through modeling, simulation, and experimentation.
• Drive technology pathfinding for heterogeneous and 3D device integration.
• Mentor researchers and foster technical excellence across the organization.
• Provide technical leadership for customer engagements and internal development programs.
• Communicate technical results and recommendations to key stakeholders.

Qualifications

• Ph.D. in Materials Science, Mechanical, Chemical, Electrical Engineering, Physics, Chemistry, Nanotechnology, or a related field.
• 5+ years of semiconductor R&D experience.
• Strong expertise in advanced packaging, heterogeneous integration, and/or 3D device integration.
• Hands-on experience in wafer bonding, process integration, or related semiconductor technologies.
• Proven problem-solving, analytical, and experimental skills.
• Strong project management and organizational capabilities.
• Understanding of semiconductor technology roadmaps and industry trends.
• Excellent verbal and written communication skills.
• Strong record of technical innovation through publications, patents, or industry contributions.
• Demonstrated leadership in cross-functional technical programs.
• Ability to work effectively in a multicultural and global environment.

Benefits

• Medical, Vision, and Dental Insurance
• Paid Personal Leave
• Holiday Time
• 401(k) Retirement Plans and Employer Matching
• Tuition Reimbursement
• Incentives for Healthy Lifestyles
• Employee Assistance Programs

Pay

Salary ranges from $123,806.02 - $174,945.55. Individual pay is determined based on multiple factors, including but not limited to location, experience, skills, job-related knowledge, relevant education, certifications, and/or training. In addition to base salary, we offer a comprehensive benefits package and for certain roles eligibility in our bonus plan and long-term incentives as applicable.

Travel

Up to 20%

Equal Opportunity Employer

TEL US is an Equal Employment Opportunity / Affirmative Action employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, age, national origin, protected veteran status, disability status, sexual orientation, gender identity or expression, marital status, genetic information, or any other characteristic protected by law.