Senior Engineer / Principal Engineer / Member of Technical Staff, Analog / Mixed-signal Design Architect, Next-generation HBM Architecture

Responsibilities

• Design, optimize, and simulate critical analog and/or mixed-signal circuits.
• Architect and design power delivery for high-performance, stacked memories.
• Analyze, specify, and prototype on-/off-chip interfaces.
• Perform timing, area, power, and complexity analysis for high-performance, low-power circuits.
• Define architectures for improved thermal management.
• Conduct pathfinding activities for future-generation stacked-memory products.
• Compose and maintain clear architecture documentation.

Requirements

• Experience with analog and/or mixed-signal design, including simulation and floorplanning.
• Experience with transistor-level simulation (e.g., FineSim, HSPICE) including corner analysis.
• Ability to analyze architecture tradeoffs and use findings to develop specifications.
• Experience with power delivery analysis, tradeoffs, constraints, and challenges.

Qualifications

• Familiarity with DRAM or high-performance, 3D-stacked memory devices like HBM.
• Contributions to thermal and/or power delivery solutions for stacked architectures.
• Experience in one or more scripting languages (e.g., Python, Perl) and hardware description language (e.g., Verilog).
• A Masters or PhD in Computer Science, Computer Engineering, Electrical Engineering, or equivalent experience.
• 5+ years of proven experience delivering mixed-signal circuit designs, 3D-stacked memory or logic designs, or complex packaging architectures.

Pay

The US base salary range that Micron Technology estimates it could pay for this full-time position is: $177,000.00 - $309,000.00 a year. Additional Compensation May Include Benefits, Bonuses And Equity.