Jobs · Design · California

HBM SoC Physical Design Engineer, Senior Member of Technical Staff

Micron Technology · San Francisco Bay Area · 1 wk ago
On-siteDesignFull-time

Key Responsibilities

  • Own physical implementation for SoC blocks and/or top-level, including floor planning, placement, CTS, routing, and physical optimization to meet PPA targets.
  • Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs.
  • Collaborate with design and integration teams to ensure clean implementation of clocking/reset strategy, power architecture, and SoC integration requirements.
  • Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY-adjacent logic) with focus on robust physical integration and timing/power integrity.
  • Perform and/or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, addressing violations efficiently.
  • Work with packaging, assembly, test, probe, and manufacturing stakeholders to ensure design meets manufacturability and quality requirements.
  • Support tapeout execution (checklists, ECO flows, signoff reviews) and contribute to post-silicon debug by correlating silicon behavior with PD/STA/power analysis.
  • Identify flow gaps and improve productivity through scripting, automation, and the development of best-practice methodologies.

Required Qualifications

  • Strong experience in SoC physical design implementation from netlist to GDSII on advanced nodes and complex designs.
  • Proficiency with industry EDA tools (e.g., Cadence Innovus/Tempus, Synopsys ICC2/PrimeTime, Siemens Calibre or equivalent).
  • Experience with power intent and power delivery considerations (e.g., UPF/CPF concepts, power grid planning, power gating implications).
  • Exposure to hierarchical physical design, top-level assembly, partitioning guidelines, and large-scale integration methodology.
  • Knowledge of IR/EM analysis, noise, coupling/crosstalk considerations, and mitigation strategies.
  • Proven tapeout history on advanced foundries (e.g., TSMC) and understanding of full-cycle SoC development flows.
  • Strong scripting/automation skills using Python, TCL, Perl, and/or shell.

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