Senior Engineer I, Field Process

About the role

As a Senior Engineer, Field Process at ASM, you will expand ASM’s advanced film technologies at a customer site in Hillsboro, OR. You will develop, optimize, and transfer innovative ALD, PEALD, PECVD, epitaxy, and LPCVD processes, acting as the technical liaison between the customer’s engineering teams and ASM’s global Business Unit. Your work supports ASM’s mission to accelerate next‑generation semiconductor manufacturing through collaboration, technical excellence, and customer partnership.

Responsibilities

• Develop and optimize ALD, PEALD, PECVD, epitaxy, and LPCVD thin‑film processes at a customer fab site.
• Serve as the technical link between customer engineering teams and ASM’s global Business Unit to ensure smooth introduction of new products and processes.
• Design, execute, and interpret design‑of‑experiments (DOE) and statistical studies.
• Troubleshoot process issues using structured problem‑analysis methods (e.g., KT, FMEA, Ishikawa, 7‑step methodologies).
• Characterize thin films using vacuum techniques, metrology, and thin‑film characterization tools.
• Travel to customer sites for training, engagement, and support, including extended hours or weekends during qualifications or escalations.
• Maintain confidentiality and uphold intellectual‑property boundaries.
• Communicate technical concepts clearly in both verbal and written formats.

Requirements

• MS degree with relevant internship, research, or academic project experience, or PhD with relevant academic, research, or internship experience in materials science, chemical engineering, or physics.
• Hands‑on experience (internships, research, or academic projects) processing, developing, or characterizing thin films using thermal ALD, plasma ALD, plasma CVD, epitaxy, or LPCVD reactors.
• Demonstrated troubleshooting and structured problem‑analysis skills (e.g., KT, FMEA, Ishikawa, 7‑step methodologies).
• Experience designing, running, and interpreting DOEs or statistical experiments.
• Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin‑film characterization.
• Willingness and ability to travel as needed for training and customer engagement; flexibility to support extended hours or weekends during qualifications or escalations.
• Strong verbal and written communication skills with the ability to explain technical concepts clearly.
• Ability to maintain confidentiality and uphold IP boundaries.

Preferred qualifications

• Internship, research, or academic experience with ASM ALD, PEALD, PECVD, epitaxy, or vertical‑furnace LPCVD equipment.
• Proven success optimizing deposition processes in research, pilot, or high‑volume manufacturing‑adjacent environments.
• Experience participating in customer‑facing technical discussions, presentations, or technical reviews.
• Background supporting process transfer, scale‑up, or qualification activities in academic, pilot, or industrial settings.
• Experience collaborating cross‑functionally and contributing to structured action plans during technical challenges or escalations.