Senior Engineer I, Field Process

About the role

As a Senior Engineer, Field Process, you will help expand ASM’s advanced film technologies at our customer’s Oregon site by developing, optimizing, and transferring innovative ALD, PEALD, PECVD, Epitaxy, and LPCVD processes. You will serve as the technical link between customer engineering teams and ASM’s global Business Unit, ensuring new products and processes are introduced smoothly and successfully. Your work directly supports ASM’s mission to accelerate next‑generation semiconductor manufacturing through collaboration, technical excellence, and customer partnership.

Responsibilities

• Develop, optimize, and transfer thin-film processes (ALD, PEALD, PECVD, Epitaxy, LPCVD) at a customer site.
• Act as the technical liaison between customer engineering teams and ASM’s global Business Unit.
• Support smooth introduction of new products and processes at the customer’s Oregon facility.

Requirements

• MS degree with relevant internship, research, or academic project experience, or PhD with relevant academic, research, or internship experience in materials science, chemical engineering, or physics.
• Hands-on experience processing, developing, or characterizing thin films using thermal ALD, plasma ALD, plasma CVD, epitaxy, or LPCVD reactors through internships, research, or academic projects.
• Demonstrated troubleshooting and structured problem-analysis skills (e.g., KT, FMEA, Ishikawa, 7-step methodologies) gained through internships, lab work, or research projects.
• Experience designing, running, and interpreting DOEs or statistical experiments in academic, research, or internship settings.
• Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin film characterization through coursework, lab work, or internships.
• Willingness and ability to travel as needed for training and customer engagement; flexibility to support extended hours or weekends during qualifications or escalations.
• Strong verbal and written communication skills, with the ability to clearly explain technical concepts.
• Ability to maintain confidentiality and uphold IP boundaries.

Qualifications

• MS degree with relevant internship, research, or academic project experience, or PhD with relevant academic, research, or internship experience in materials science, chemical engineering, or physics.
• Hands-on experience processing, developing, or characterizing thin films using thermal ALD, plasma ALD, plasma CVD, epitaxy, or LPCVD reactors through internships, research, or academic projects.
• Demonstrated troubleshooting and structured problem-analysis skills (e.g., KT, FMEA, Ishikawa, 7-step methodologies) gained through internships, lab work, or research projects.
• Experience designing, running, and interpreting DOEs and statistical experiments.
• Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin‑film characterization.
• Ability to travel as needed for training and customer engagement; flexibility to support extended hours or weekends during qualifications or escalations.
• Strong verbal and written communication skills, able to explain complex concepts clearly.
• Ability to maintain confidentiality and uphold IP boundaries.

Skills

• Internship, research, or academic experience with ASM ALD, PEALD, PECVD, epitaxy, or vertical furnace LPCVD equipment.
• Demonstrated success optimizing deposition processes in research, pilot, or high-volume manufacturing–adjacent environments.
• Exposure to customer-facing technical discussions, presentations, or technical reviews through internships or collaborative research.
• Experience supporting process transfer, scale-up, or qualification activities in academic, pilot, or industrial settings.
• Experience collaborating cross-functionally and contributing to structured action plans during technical challenges or escalations.