Senior Custom ASIC Engineering Lead
Job Description
Broadcom develops critical Infrastructure chips that enable a variety of Customers to produce ASICs in almost all major segments of the Semiconductor industry, including AI. Our ASIC Products Division is looking for a senior engineer to guide customer teams designing challenging chips in areas such as AI, HPC, networking and storage.
About the Role
This is an immensely responsible position, and an opportunity to push the frontiers of technology by working with cross-functional teams inside and outside of Broadcom.
Responsibilities
- Manage external customer ASIC programs from inception to finish, including RFQs, technology and IP collaterals, design, test, packaging, fabrication, bring-up and production
- Advises customers on best practices in EDA, flows and design methodologies, and by organizing Q&A sessions with Broadcom technology experts
- See ahead, plan ahead, work ahead. Proactively assess potential risks to the design quality and project schedule, then work with cross-functional teams to prepare and execute risk mitigation actions
- Execute physical design flows to check that incoming customer tape-in netlists meet Broadcom’s stringent tape-out quality standards
- Motivate and drive yourself to stay abreast of developments in Broadcom IPs, technology and end user applications
- Participate in discussions about your chips with marketing, sales, legal and regulatory compliance teams
- Be a consummate team player and assist other teams in need
Requirements
- Multiple tape-outs in advanced technology nodes
- Analyze PPA tradeoffs involved amongst various library components, and architectures
- Knowledgeable in low power design and power management
- Hands-on experience in physical design and STA, EDA tools, design flows for physical design, logic simulation, test, and packaging
- Programming in TCL, shell and scripting languages
Nice to Have
- Exposure to SERDES communications protocols
- Logic design, chip architecture, microarchitecture, Verilog RTL coding
- Front-end logic design verification, DRC, logic synthesis
- Knowledge of DFT methods including scan, memory BIST and repair
Qualifications
- Bachelors degree and 12+ years of related experience; or Masters degree and 10+ years of related experience
Skills
- Multiple tape-outs in advanced technology nodes
- Analyze PPA tradeoffs involved amongst various library components, and architectures
- Knowledgeable in low power design and power management
- Hands-on experience in physical design and STA, EDA tools, design flows for physical design, logic simulation, test, and packaging
- Programming in TCL, shell and scripting languages
Benefits
The annual base salary range for this position is $143,800 - $230,000. As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.