Lead ASIC Design Engineer

Technical Ownership

Serve as the central Chip Lead, defining top-level digital architecture, partitioning hard/soft IP blocks, and owning the complete integration lifecycle.

Act as the bridge between Logic Design, Physical Design (PD), Architecture, and Design Verification (DV) to ensure all PPA (Power, Performance, Area) targets are met.

Own and drive the final tape-out sign-off checklist, coordinating across all technical teams to ensure a clean handoff to the foundry.

Mentorship & Culture: Provide technical guidance, code reviews, and architectural mentorship to mid-level and junior engineers on the team.

Technical Execution

RTL Design: Author, optimize, and maintain high-quality, synthesizable SystemVerilog/Verilog RTL for complex digital blocks, control logic, clocking structures, and register files (CSRs).

Timing & Constraint Ownership: Drive top-level chip timing constraints (SDC), define the Clock Domain Crossing (CDC) strategy, and establish block-level timing budgets for the PD team.

Front-End Flows: Drive logic synthesis (e.g., Design Compiler, Genus), Static Timing Analysis (STA via PrimeTime/Tempus), and run static quality checks (Lint, SpyGlass, JasperGold CDC).

IP Management: Manage the integration of custom internal analog macros, mixed-signal blocks, and third-party soft/hard IP.

Silicon Validation: Collaborate with post-silicon validation and software teams during initial chip bring-up and lab debug phases.

Required Qualifications

• Education: Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
• Experience: 12+ years of direct industry experience in ASIC/SoC digital design, with a proven track record of owning chip projects or serving as a design lead.
• RTL Mastery: Expert-level proficiency in SystemVerilog/Verilog digital logic design and microarchitecture principles.
• Tool Fluency: Deep experience with front-end EDA tools for synthesis, STA, and CDC analysis (e.g., Synopsys or Cadence tool suites).
• Silicon Track Record: Must have a proven history of successful, first-pass silicon tape-outs on modern process technologies.
• Communication: Outstanding documentation and verbal communication skills; this role authors the authoritative architectural and design specifications for the entire project.

Work Authorization

Must have legal authorization to work in the US.

Preferred & Bonus Skills

• Experience with mixed-signal or high-speed PHY-adjacent architectures (e.g., SerDes, PCIe, DDR, or custom interconnects).
• Familiarity with DFT (Design for Test) planning, including scan insertion, ATPG planning, and boundary scan.
• Proficiency in scripting (Python, Tcl, Perl) to automate and streamline front-end design flows.

Compensation And Benefits

The annual base salary range for this position is $143,800 - $230,000. As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth.

Broadcom offers a competitive and comprehensive benefits package:

• Medical, dental and vision plans
• 401(K) participation including company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• Company paid holidays
• Paid sick leave and vacation time
• Follows all applicable laws for Paid Family Leave and other leaves of absence.