Semiconductor Packaging Engineer

Responsibilities

• Working with the team to explore and validate innovative semiconductor packaging processes.
• Conducting hands-on lab experiments end-to-end to test.
• Innovating novel materials for packaging, considering factors such as conductivity, mechanical strength, and thermal expansion.
• Evaluating the process to continuously improve performance.
• Collaborating closely with team members to provide technical support for experiments and methodologies.
• Creating thorough documentation, including Standard Operating Procedures (SOPs), and maintaining equipment to ensure optimal performance and safety.

Requirements

• Masters or equivalent experience in Electrical Engineering, Material Science, Mechanical Engineering, or a related field.
• 5+ years of experience in semiconductor packaging from research or industry, with a strong understanding of end-to-end packaging processes and technologies.
• Knowledge of packaging materials, thermal management, and reliability testing.
• Strong analytical and problem-solving skills, with the ability to troubleshoot complex packaging issues effectively.

Qualifications

• Nice-to-have experience in 3d printing.
• Nice-to-have experience in metal plating.
• Nice-to-have mechanical-related background.
• Nice-to-have knowledge of electronic design.

Benefits

We offer a comprehensive benefits package including:

• Medical, Dental, and Vision insurance
• Generous Paid Time Off inclusive of Holidays and Sick Time
• Visa Sponsorship
• Life and Disability Insurance
• Paid Parental Leave
• 401(k) retirement plan
• Weekly Learning & Development opportunities
• Commuter Benefits including Parking and Late Night Uber rides from the office
• Lunches daily, Dinners 3x per week, Stocked Office Kitchen with Snacks and Spindrifts

Pay

The annual salary range for this role is $110,000 – $155,000. Compensation is determined based on your qualifications and experience.

Schedule

We offer flexible scheduling to accommodate your needs.