Electronics Packaging Engineer

About the role

Do you love to design, analyze, and test mechanical hardware? Do you have a fundamental drive and fascination for solving problems of all kinds? Are you searching for impactful work in the area of electronics packaging and finite element analysis that does not confine you to working on the same thing year after year? Does making meaningful contributions to projects, that span from submarines, surface ships, UAVs, aircraft, ground vehicles, missiles, to spacecraft, sound like a dream job? If so, we are looking for someone like you to join our team at the Johns Hopkins Applied Physics Laboratory (APL). We are seeking an Electronics Packaging Engineer to help us develop mechanical systems. As a member of the Concept Design & Realization Branch, you will be working with teams of passionate engineers and scientists who design, analyze, and test systems for all of APL's Mission Areas. Our team strives to deliver robust mechanical solutions to APL's most difficult problems. Our team values leadership and communication skills and we cultivate an environment of collaboration.

Responsibilities

Your primary responsibility will be to lead the design effort of electromechanical hardware from concept through delivery, including thermal and structural analysis, detailed design, assembly, and testing.

• Work in a fast-paced environment requiring innovative solutions to difficult technical challenges.
• Promote engineering standard methodologies and work on state-of-the-art hardware.
• Work with other engineers and scientists on unique research and development efforts.
• Participate in design reviews and team meetings.
• Mentor junior members of the team.

Qualifications

Minimum qualifications:

• Bachelor's of Science in Mechanical Engineering, Aerospace Engineering or related discipline.
• 5+ years of experience in mechanical engineering.
• Experience with full product development lifecycle, including design, structural/thermal analysis, and integration.
• Familiarity with CAD and CAE software (CREO, SolidWorks, ANSYS, FEMAP, etc).
• A proven ability to work closely with engineering teams to develop systems.
• High initiative, motivation, flexibility, and interest in working in a fast-paced team environment.
• Good communications and team building skills.
• Occasional travel to government and contractor facilities as required.
• Occasional work in secure facilities.
• Ability to obtain a Secret level security clearance (U.S. citizenship required).

Preferred qualifications:

• Master's Degree in Mechanical Engineering, Aerospace Engineering or related discipline.
• Prior experience designing, analyzing, and qualifying electromechanical systems for military applications.
• Hands-on experience with thermal and structural analysis.
• Completed several mechanical packaging projects from start to finish.
• Demonstrated ability to work closely with engineering teams in all phases of the design, analysis, assembly, and testing process.
• Familiarity with NASA and MIL requirements.

Benefits

APL offers a vibrant, welcoming atmosphere where you can bring your authentic self to work, continue to grow, and build strong connections with inspiring teammates. The company celebrates differences of perspectives and encourages creativity and bold, new ideas. Employees enjoy generous benefits, including a robust education assistance program, unparalleled retirement contributions, and a healthy work/l