Mechanical Design Engineer - Semiconductor Packaging

About the role

We are seeking a proactive and detail-oriented Mechanical Design Engineer to serve as a key point of contact for all collateral design activities supporting semiconductor packaging architecture. This individual will play a critical role in designing and developing mechanical components and tooling required throughout the packaging and assembly lifecycle. The ideal candidate is a strong communicator with excellent time and project management skills, capable of working cross-functionally and solving complex design problems with minimal supervision.

Responsibilities

• Design Tape and Reel packaging for semiconductor die shipments from Fab to Assembly.
• Develop and maintain mechanical designs and detailed drawings for:
  • Substrates
  • Integrated Heat Spreaders (IHS)
  • Stiffeners
  • Overall package assemblies
• Design process media trays used during various stages of the assembly process.
• Collaborate closely with architecture, process, and assembly teams to ensure design intent and manufacturability.
• Act as the single point of contact for all packaging mechanical design collateral needs.
• Proactively identify and solve design and process issues, ensuring timely project execution.

Behavioral Traits

• Problem-solving skills and a proactive approach to challenges.
• Excellent communication and interpersonal skills for effective cross-functional collaboration.
• Ability to manage multiple tasks and projects simultaneously under tight deadlines.

Qualifications

Minimum Qualifications

• Bachelor's degree in mechanical engineering or in a STEM related field of study.
• 1+ year of experience in:
  • 2D and 3D CAD software.
  • Mechanical design foundation and 3D spatial awareness.
  • Interpret and generate technical drawings and specifications.

Preferred Qualifications

• Master's degree in mechanical engineering or in a STEM related field of study.
• 2+ years' experience with CAD tools such as SolidWorks, Siemens NX, and AutoCAD is highly preferred.
• Experience in semiconductor packaging or related high-precision manufacturing environments.
• Familiarity with material properties and mechanical tolerances used in package design and tooling.

This position is not eligible for Intel immigration sponsorship.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Pay

Annual Salary Range for jobs which could be performed in the US: $105,650.00 - 149,150.00 USD. The range displayed reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Schedule

This role requires an on-site presence on Shift 1 (United States of America).

Primary location: US, Arizona, Phoenix.