Reliability Engineer (Hardware)

About the role

Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. In this role you will design, execute, and analyze reliability tests to verify product performance, durability, and compliance with standards. You will enable our products to meet or exceed reliability requirements throughout their lifecycle by developing robust test protocols, analyzing failures, and working with cross-functional teams to drive improvements in design and manufacturing processes.

Responsibilities

• Develop reliability test plans based on product requirements, industry standards, and customer expectations.
• Execute reliability qualification testing for our highly integrated photonics-based AI platform and our photonics chiplet communication fabric products.
• Conduct Failure Modes and Effects Analysis (FMEA) to identify and mitigate potential reliability risks in device design and manufacturing.
• Perform detailed root cause analysis of device failures, and collaborate with cross-functional teams to resolve reliability issues, refine product designs, and improve process robustness.
• Establish internal reliability guidelines and standards to meet customer requirements and industry benchmarks.
• Utilize statistical analysis tools to model reliability performance and predict device lifetimes under field conditions.
• Prepare and present detailed technical reports, including reliability test plans, results, and risk assessments, to internal and external stakeholders.

Requirements

• Bachelor's degree in Electrical Engineering, Computer Engineering or a similar field.
• 5+ years of industry experience working as a Reliability Engineer within the semiconductor and/or photonics industry.
• Understanding of device and package reliability testing methodologies, including HTOL, HAST, TDDB, HTHH, TC etc.
• Hands-on experience with failure analysis tools and techniques such as SEM, TEM, FIB, and EMMI etc.
• Knowledge of device physics, reliability and failure mechanism in Serdes/digital/mixed signal IC’s.
• Good understanding of packaging failure mechanisms and risks on TSV, solder joints, warpage, metal migrations etc.
• Familiarity with reliability modeling tools and statistical analysis (e.g., Weibull analysis, Minitab, JMP).

Preferred Qualifications

• Experience in semiconductor or photonics device/module testing.
• Experience with advanced packaging technologies such as flip-chip, wafer-level packaging, or 3D integration.
• Good statistical data analysis skills to analyze pre vs post reliability data.
• Excellent communication and presentation skills, with the ability to convey complex reliability concepts to diverse audiences.
• PhD in Electrical Engineering, Computer Engineering or a similar field, with at least 1 year working as a Reliability Engineer.

Pay

The base salary range for this role is $142,000 USD - $200,000 USD, determined based on location, experience, educational background, and market data. Total compensation goes beyond base salary and includes a new hire equity grant, annual performance-based equity, and other rewards that recognize your impact and contribution.

Benefits

• Comprehensive Health Care Plan (Medical, Dental & Vision)
• Retirement Savings Matching Program
• Life Insurance (Basic, Voluntary & AD&D)
• Generous Time Off (Vacation, Sick & Public Holidays)
• Paid Family Leave
• Short Term & Long Term Disability
• Training & Development
• Commuter Benefits
• Flexible, hybrid workplace model
• Equity grants (applicable to full-time employees)

Benefits eligibility may vary depending on your employment status and location.